Xiaolei Tong
Current Organizations / Institutes
The organizations/institutes from the scholar's latest article
Xiaolei Tong has a total of 14 co-authors. Here are the top co-authors by number of shared publications:
- Pedram Yousefian
Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, PA, USA
4 shared publications - Roy H. Olsson
University of Pennsylvania
4 shared publications - Chin-Yu Chang
Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, USA
2 shared publications Ella Klein
Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, PA, USA
2 shared publications- Deep Jariwala
University of Pennsylvania
1 shared publication - Dhiren Kumar Pradhan
Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, USA
1 shared publication
Latest Publications
- 20 March 2026
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Electron Device Letters
- Vol. PP (07413106) , 1
Low-Field Ferroelectricity in 10 nm AlBScN Thin Films
Ferroelectric aluminum scandium nitride (Al1-xScxN, AlScN) offers CMOS-compatible integration but suffers from high coercive fields and leakage currents that hinder thickness scaling. Further reduction in thickness is essential for low-voltage embedded nonvolatile memory applications. Boron incorporation into AlScN (AlBScN) suppresses leakage current in films down to 40 nm, yet its ferroelectric characteristics in ultrathin films remain unexplored. This letter demonstrates robust ferroelectric switching in 10 nm sputtered AlBScN capacitors with a low coercive field and approximately two orders of magnitude lower leakage than AlScN. Notably, The coercive field (Ec) extracted from capacitance-voltage measurements was 2.3 MV/cm, and the onset of symmetric polarization reversal was observed near 4.6 MV/cm in positive-up-negative-down (PUND) measurements using 2 μs pulses. Moreover, the breakdown field (EBD) was determined to be 10.0 MV/cm for 10 μm diameter capacitors, suggesting a substantial margin between EBD and Ec for reliable operation. These findings demonstrate AlBScN as a promising candidate for CMOS back-end-of-line (BEOL) compatible ferroelectric applications with improved energy consumption and reduced leakage current.
- 20 March 2026
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Electron Device Letters
- Vol. PP (07413106) , 1
Low-Field Ferroelectricity in 10 nm AlBScN Thin Films
Ferroelectric aluminum scandium nitride (Al1-xScxN, AlScN) offers CMOS-compatible integration but suffers from high coercive fields and leakage currents that hinder thickness scaling. Further reduction in thickness is essential for low-voltage embedded nonvolatile memory applications. Boron incorporation into AlScN (AlBScN) suppresses leakage current in films down to 40 nm, yet its ferroelectric characteristics in ultrathin films remain unexplored. This letter demonstrates robust ferroelectric switching in 10 nm sputtered AlBScN capacitors with a low coercive field and approximately two orders of magnitude lower leakage than AlScN. Notably, The coercive field (Ec) extracted from capacitance-voltage measurements was 2.3 MV/cm, and the onset of symmetric polarization reversal was observed near 4.6 MV/cm in positive-up-negative-down (PUND) measurements using 2 μs pulses. Moreover, the breakdown field (EBD) was determined to be 10.0 MV/cm for 10 μm diameter capacitors, suggesting a substantial margin between EBD and Ec for reliable operation. These findings demonstrate AlBScN as a promising candidate for CMOS back-end-of-line (BEOL) compatible ferroelectric applications with improved energy consumption and reduced leakage current.
- 24 December 2025
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Ultrasonics
- Vol. 73 (2) , 218-226
A 5.9 GHz Sezawa SAW Acoustic Delay Line Based on Al 0.6 Sc 0.4 N-on-Sapphire With Propagation Q -Factor of 3044
In this work, we demonstrate a high-performance surface acoustic wave (SAW) delay line based on a Scandium alloyed aluminum nitride (AlScN)-on-sapphire platform operating at 5.9 GHz with an exceptionally high acoustic propagation Q-factor. An 800 nm AlScN thin film with 40% scandium alloying concentration was deposited on a thick sapphire substrate to achieve strong acoustic energy confinement and large electromechanical coupling, thereby minimizing the insertion loss (IL) and propagation loss (PL) of the acoustic delay line (ADL). The proposed ADL was designed to operate in the Sezawa mode using a Single-Phase Unidirectional Transducer (SPUDT) electrode configuration for better unidirectionality. The fabricated ADLs with different delay lengths, after conjugate matching, exhibited delay times spanning 13 to 214 ns and IL ranging from 7.6 to 18.3 dB. The extracted PL reached as low as 9.2 dB/mm at 5.9 GHz, with a group velocity (vg) of around 5,779 m/s. Based on these results, the proposed ADLs exhibit a high acoustic propagation Q-factor of 3,044. These findings highlight the potential of AlScN-on-sapphire platforms for high operational frequency, low-loss SAW ADL devices in advanced RF applications.
- 24 December 2025
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Ultrasonics
- Vol. 73 (2) , 218-226
A 5.9 GHz Sezawa SAW Acoustic Delay Line Based on Al 0.6 Sc 0.4 N-on-Sapphire With Propagation Q -Factor of 3044
In this work, we demonstrate a high-performance surface acoustic wave (SAW) delay line based on a Scandium alloyed aluminum nitride (AlScN)-on-sapphire platform operating at 5.9 GHz with an exceptionally high acoustic propagation Q-factor. An 800 nm AlScN thin film with 40% scandium alloying concentration was deposited on a thick sapphire substrate to achieve strong acoustic energy confinement and large electromechanical coupling, thereby minimizing the insertion loss (IL) and propagation loss (PL) of the acoustic delay line (ADL). The proposed ADL was designed to operate in the Sezawa mode using a Single-Phase Unidirectional Transducer (SPUDT) electrode configuration for better unidirectionality. The fabricated ADLs with different delay lengths, after conjugate matching, exhibited delay times spanning 13 to 214 ns and IL ranging from 7.6 to 18.3 dB. The extracted PL reached as low as 9.2 dB/mm at 5.9 GHz, with a group velocity (vg) of around 5,779 m/s. Based on these results, the proposed ADLs exhibit a high acoustic propagation Q-factor of 3,044. These findings highlight the potential of AlScN-on-sapphire platforms for high operational frequency, low-loss SAW ADL devices in advanced RF applications.
- 6 November 2025
- Published by Institute of Electrical and Electronics Engineers (IEEE) in Journal of Microelectromechanical Systems
- Vol. 35 (1) , 4-6
High-Frequency Sezawa Mode Surface Acoustic Wave Resonators Using Boron-Doped AlScN on SiC and Sapphire Substrates
This letter presents Sezawa mode surface acoustic wave (SAW) resonators based on 500 nm boron-doped aluminum scandium nitride (Al ${}_{\mathbf {1-x-y}}$ B ${}_{\mathbf {x}}$ Sc ${}_{\mathbf {y}}$ N), AlBScN thin films co-sputtered from AlB and Sc targets onto sapphire and silicon carbide (SiC) substrates. The devices exhibit series resonance frequencies ranging from 4.3 GHz to 7.6 GHz. Atomic Force Microscopy (AFM) revealed smooth film surfaces, with root mean square roughness values of 0.65 and 0.54 nm on sapphire and SiC, respectively. X-ray diffraction (XRD) $\omega $ -scans around the wurtzite (002) reflection confirmed a highly c-axis oriented film exhibiting a full width at half maximum of 0.96° on sapphire. Electrical measurements revealed a maximum Sezawa mode velocity of 6748 m/s on SiC, while the sapphire-based device achieved a peak parallel resonance quality factor ( $Q$ ${}_{\mathbf {p}}$ ) of 1400. These results demonstrate the suitability of AlBScN for high-frequency, high-performance resonator applications.[2025-0143]
- 6 November 2025
- Published by Institute of Electrical and Electronics Engineers (IEEE) in Journal of Microelectromechanical Systems
- Vol. 35 (1) , 4-6
High-Frequency Sezawa Mode Surface Acoustic Wave Resonators Using Boron-Doped AlScN on SiC and Sapphire Substrates
This letter presents Sezawa mode surface acoustic wave (SAW) resonators based on 500 nm boron-doped aluminum scandium nitride (Al ${}_{\mathbf {1-x-y}}$ B ${}_{\mathbf {x}}$ Sc ${}_{\mathbf {y}}$ N), AlBScN thin films co-sputtered from AlB and Sc targets onto sapphire and silicon carbide (SiC) substrates. The devices exhibit series resonance frequencies ranging from 4.3 GHz to 7.6 GHz. Atomic Force Microscopy (AFM) revealed smooth film surfaces, with root mean square roughness values of 0.65 and 0.54 nm on sapphire and SiC, respectively. X-ray diffraction (XRD) $\omega $ -scans around the wurtzite (002) reflection confirmed a highly c-axis oriented film exhibiting a full width at half maximum of 0.96° on sapphire. Electrical measurements revealed a maximum Sezawa mode velocity of 6748 m/s on SiC, while the sapphire-based device achieved a peak parallel resonance quality factor ( $Q$ ${}_{\mathbf {p}}$ ) of 1400. These results demonstrate the suitability of AlBScN for high-frequency, high-performance resonator applications.[2025-0143]
- 10 July 2025
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Electron Device Letters
- Vol. 46 (9) , 1545-1548
Leakage Suppression Across Temperature in Al1-xScxN Thin Film Ferroelectric Capacitors Through Boron Incorporation
This letter presents high-temperature ferroelectric characterization of 40 nm ${\mathrm {Al}}_{\text {1-x-y}}$ BxScyN (AlBScN) thin film capacitors grown by co-sputtering Al0.89B0.11 and Sc targets onto Pt(111)/Ti(002)/Si(100) substrates. Structural analysis confirmed a c-axis-oriented wurtzite structure with a low surface roughness of 1.37 nm. Ferroelectric switching, characterized by positive-up-negative-down (PUND) measurements up to 600° C, exhibited a linear decrease in coercive fields from 6.2 MV/cm at room temperature to 4.2 MV/cm at 600°C, while remanent polarization remained stable with temperature. Direct current I–V measurements highlight a significant suppression of leakage currents, over two orders of magnitude lower compared to AlScN capacitors fabricated under similar conditions. These results position AlBScN thin films as strong candidates for ferroelectric applications in extreme environments.
- 10 July 2025
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Electron Device Letters
- Vol. 46 (9) , 1545-1548
Leakage Suppression Across Temperature in Al1-xScxN Thin Film Ferroelectric Capacitors Through Boron Incorporation
This letter presents high-temperature ferroelectric characterization of 40 nm ${\mathrm {Al}}_{\text {1-x-y}}$ BxScyN (AlBScN) thin film capacitors grown by co-sputtering Al0.89B0.11 and Sc targets onto Pt(111)/Ti(002)/Si(100) substrates. Structural analysis confirmed a c-axis-oriented wurtzite structure with a low surface roughness of 1.37 nm. Ferroelectric switching, characterized by positive-up-negative-down (PUND) measurements up to 600° C, exhibited a linear decrease in coercive fields from 6.2 MV/cm at room temperature to 4.2 MV/cm at 600°C, while remanent polarization remained stable with temperature. Direct current I–V measurements highlight a significant suppression of leakage currents, over two orders of magnitude lower compared to AlScN capacitors fabricated under similar conditions. These results position AlBScN thin films as strong candidates for ferroelectric applications in extreme environments.