Magomed A. Umakhanov
Current Organizations / Institutes
The organizations/institutes from the scholar's latest article
Research Subjects
Magomed A. Umakhanov has a total of 8 co-authors. Here are the top co-authors by number of shared publications:
- Abubakar M. Ismailov
Dagestan State University, Makhachkala, Russia
2 shared publications - Azat Abdullaev
Center for Energy and Advanced Materials Science, National Laboratory Astana, Astana 010000, Kazakhstan
2 shared publications - Jacques O'COnnell
Centre for HRTEM, Nelson Mandela University, Port Elizabeth 6001, South Africa
2 shared publications - Kairolla Sekerbayev
Center for Energy and Advanced Materials Science, National Laboratory Astana, Astana, Kazakhstan; Physics department, Nazarbayev University, Astana, Kazakhstan; Institute of New Materials and Energy Technologies, Astana, Kazakhstan, Kazakhstan
2 shared publications - Murtuzali R. Rabadanov
Dagestan State University, Makhachkala, Russia, Russia
2 shared publications - Rustem Tlegenov
Center for Energy and Advanced Materials Science, National Laboratory Astana, Astana 010000, Kazakhstan
2 shared publications
Latest Publications
- Open Access
- 6 November 2026
- Published by MDPI AG in Nanomaterials
- Vol. 16 (21) , 1439
Tuning Thermal Transport in Radio-Frequency-Sputtered Beta-Gallium Oxide Through Thickness and Plasma-Induced Interface Modification
Controlling heat flow in beta-gallium oxide (β-Ga2O3) thin films requires understanding both phonon transport within the semiconductor and heat transfer across metal/semiconductor interfaces. Here, we investigate these pathways in high-temperature radio-frequency magnetron-sputtered β-Ga2O3 films grown on c-plane sapphire with thicknesses from 0.42 to 2.1 μm. The thermal conductivity increases from 5.4–6.9 W m−1 K−1 in the 420 nm film to approximately 10–12 W m−1 K−1 in the thicker films. Structural characterization reveals thickness-dependent microstructural evolution, including grain coarsening and intergranular void-like defects. An analytical Debye–Klemens model incorporating phonon scattering from film boundary and defects reproduces the overall thickness dependence. The Ar plasma-treated samples exhibit Al/β-Ga2O3 thermal boundary conductance values of approximately 100 MW m−2 K−1, about 70% higher than the untreated sample (~60 MW m−2 K−1), while the thermal conductivity of the underlying films remains within a comparable range. Picosecond acoustic measurements, transmission electron microscopy and electron energy loss spectroscopy reveal a corresponding modification of the interfacial acoustic response and formation of an ultrathin amorphous/disordered near-surface region. Although variations between independent deposition runs cannot be excluded, these findings suggest that thickness-dependent microstructure and plasma-associated interface modifications offer promising approaches to tailoring thermal transport in β-Ga2O3-based devices.
- 6 November 2026
- Published by MDPI AG in Nanomaterials
- Vol. 16 (21) , 1439
Open AccessTuning Thermal Transport in Radio-Frequency-Sputtered Beta-Gallium Oxide Through Thickness and Plasma-Induced Interface Modification
Controlling heat flow in beta-gallium oxide (β-Ga2O3) thin films requires understanding both phonon transport within the semiconductor and heat transfer across metal/semiconductor interfaces. Here, we investigate these pathways in high-temperature radio-frequency magnetron-sputtered β-Ga2O3 films grown on c-plane sapphire with thicknesses from 0.42 to 2.1 μm. The thermal conductivity increases from 5.4–6.9 W m−1 K−1 in the 420 nm film to approximately 10–12 W m−1 K−1 in the thicker films. Structural characterization reveals thickness-dependent microstructural evolution, including grain coarsening and intergranular void-like defects. An analytical Debye–Klemens model incorporating phonon scattering from film boundary and defects reproduces the overall thickness dependence. The Ar plasma-treated samples exhibit Al/β-Ga2O3 thermal boundary conductance values of approximately 100 MW m−2 K−1, about 70% higher than the untreated sample (~60 MW m−2 K−1), while the thermal conductivity of the underlying films remains within a comparable range. Picosecond acoustic measurements, transmission electron microscopy and electron energy loss spectroscopy reveal a corresponding modification of the interfacial acoustic response and formation of an ultrathin amorphous/disordered near-surface region. Although variations between independent deposition runs cannot be excluded, these findings suggest that thickness-dependent microstructure and plasma-associated interface modifications offer promising approaches to tailoring thermal transport in β-Ga2O3-based devices.
- Open Access
- 7 October 2026
- Published by MDPI AG in Preprints.org
Tuning Thermal Transport in RF-Sputtered β-Ga₂O₃ Through Thickness and Plasma-Induced Interface Modification
Controlling heat flow in β-Ga₂O₃ thin films requires understanding both phonon transport within the semiconductor and heat transfer across metal/semiconductor interfaces. Here, we investigate these pathways in high-temperature RF magnetron-sputtered β-Ga₂O₃ films grown on c-plane sapphire with thicknesses from 0.42 to 2.1 μm. The thermal conductivity increases from 5.4–6.9 W m⁻¹ K⁻¹ in the 420 nm film to approximately 10–12 W m⁻¹ K⁻¹ in the thicker films. Structural characterization reveals thickness-dependent microstructural evolution, including grain coarsening and intergranular void-like defects. A semi-analytical Debye–Klemens model incorporating phonon scattering from film boundary and defects reproduces the overall thickness dependence. We further demonstrate that Ar plasma treatment provides an effective means of modifying interfacial heat transfer: the Al/β-Ga₂O₃ thermal boundary conductance increases from approximately 60 to 100 MW m⁻² K⁻¹, or by about 70%, while the thermal conductivity of the underlying β-Ga₂O₃ remains comparatively unchanged. Picosecond laser ultrasonic measurements and cross-sectional TEM reveal a corresponding modification of the interfacial acoustic response and formation of an ultrathin amorphous/disordered near-surface region. These results demonstrate that thermal transport in sputtered β-Ga₂O₃ can be independently tuned through film-thickness-dependent microstructure and near-surface interface modification, providing practical routes for thermal management in β-Ga₂O₃-based devices.
- 7 October 2026
- Published by MDPI AG in Preprints.org
Open AccessTuning Thermal Transport in RF-Sputtered β-Ga₂O₃ Through Thickness and Plasma-Induced Interface Modification
Controlling heat flow in β-Ga₂O₃ thin films requires understanding both phonon transport within the semiconductor and heat transfer across metal/semiconductor interfaces. Here, we investigate these pathways in high-temperature RF magnetron-sputtered β-Ga₂O₃ films grown on c-plane sapphire with thicknesses from 0.42 to 2.1 μm. The thermal conductivity increases from 5.4–6.9 W m⁻¹ K⁻¹ in the 420 nm film to approximately 10–12 W m⁻¹ K⁻¹ in the thicker films. Structural characterization reveals thickness-dependent microstructural evolution, including grain coarsening and intergranular void-like defects. A semi-analytical Debye–Klemens model incorporating phonon scattering from film boundary and defects reproduces the overall thickness dependence. We further demonstrate that Ar plasma treatment provides an effective means of modifying interfacial heat transfer: the Al/β-Ga₂O₃ thermal boundary conductance increases from approximately 60 to 100 MW m⁻² K⁻¹, or by about 70%, while the thermal conductivity of the underlying β-Ga₂O₃ remains comparatively unchanged. Picosecond laser ultrasonic measurements and cross-sectional TEM reveal a corresponding modification of the interfacial acoustic response and formation of an ultrathin amorphous/disordered near-surface region. These results demonstrate that thermal transport in sputtered β-Ga₂O₃ can be independently tuned through film-thickness-dependent microstructure and near-surface interface modification, providing practical routes for thermal management in β-Ga₂O₃-based devices.