Eric Schadow
Current Organizations / Institutes
The organizations/institutes from the scholar's latest article
Research Subjects
Research Interests
Eric Schadow has a total of 5 co-authors. Here are the top co-authors by number of shared publications:
- Christoph Hecht
Institute for Factory Automation and Production Systems (FAPS), Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU), 90429 Nürnberg, Germany
1 shared publication Felix Haeussler
Friedrich-Alexander-Universität Erlangen-Nürnberg
1 shared publication- Jörg Franke
Institute for Factory Automation and Production Systems (FAPS), Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU) , Fürther Straße 246b, 90429 Nuremberg
1 shared publication - Mario Sprenger
Friedrich-Alexander-Universität Erlangen-Nürnberg
1 shared publication - Thomas Stoll
Professorship of Laser-Based Additive Manufacturing, School of Engineering and Design, Technical University of Munich (TUM), Garching Bei Munich, Germany
1 shared publication
Latest Publications
- Open Access
- 1 January 2023
- Published by IMAPS - International Microelectronics Assembly and Packaging Society in International Symposium on Microelectronics
- Vol. 2023 (EMPC) , 129-134
Additive Metallization of Alumina with Copper-Titanium Powder Blends for Power Electronic Applications
Additive manufacturing shows great potential to further increase the performance of power electronic modules through novel packaging concepts. Such an approach is the integrated manufacturing of metal-ceramic substrates by means of laser powder bed fusion of metals (PBF-LB/M). With this layered additive manufacturing process, planar ceramic substrates can be metallized and electrically functionalized for power electronic applications. In this paper Al2O3 ceramic substrates are metallized via PBF-LB/M by selectively melting applied powder layers with software defined geometries. The investigated powders are mixtures of copper and titanium powders with 1 wt.%, 5 wt.% and 10 wt.% titanium in order to enable bonding by creating a titanium-oxide reaction layer at the interface to the ceramic. Shear tests and microstructural investigations show that a subsequent heat treatment increases the adhesion and density of the metallization. By energy dispersive X-ray microscopy (EDX) the partial formation of reaction layers is detected.
- 1 January 2023
- Published by IMAPS - International Microelectronics Assembly and Packaging Society in International Symposium on Microelectronics
- Vol. 2023 (EMPC) , 129-134
Open AccessAdditive Metallization of Alumina with Copper-Titanium Powder Blends for Power Electronic Applications
Additive manufacturing shows great potential to further increase the performance of power electronic modules through novel packaging concepts. Such an approach is the integrated manufacturing of metal-ceramic substrates by means of laser powder bed fusion of metals (PBF-LB/M). With this layered additive manufacturing process, planar ceramic substrates can be metallized and electrically functionalized for power electronic applications. In this paper Al2O3 ceramic substrates are metallized via PBF-LB/M by selectively melting applied powder layers with software defined geometries. The investigated powders are mixtures of copper and titanium powders with 1 wt.%, 5 wt.% and 10 wt.% titanium in order to enable bonding by creating a titanium-oxide reaction layer at the interface to the ceramic. Shear tests and microstructural investigations show that a subsequent heat treatment increases the adhesion and density of the metallization. By energy dispersive X-ray microscopy (EDX) the partial formation of reaction layers is detected.