Juan Pu
Current Organizations / Institutes
The organizations/institutes from the scholar's latest article
Research Subjects
Juan Pu has a total of 5 co-authors. Here are the top co-authors by number of shared publications:
- Dong Jin
Henan Key Laboratory of Advanced Conductor Materials, Institute of Materials, Henan Academy of Sciences, Zhengzhou 450046, China
1 shared publication - Fei Long
Henan Key Laboratory of Advanced Conductor Materials, Institute of Materials, Henan Academy of Sciences, Zhengzhou 450046, China
1 shared publication - Xiangping Xu
School of Materials Science and Engineering, Jiangsu University of Science and Technology, Zhenjiang, China
1 shared publication - Xiaohui Shi
Xinxiang Qixing Brazing Technology Co., Ltd., Xinxiang 453003, China
1 shared publication - Zhaoqi Zhang
Henan Key Laboratory of Advanced Conductor Materials, Institute of Materials, Henan Academy of Sciences, Zhengzhou 450046, China
1 shared publication
Latest Publications
- Open Access
Welding Techniques and Microstructural Control for Dissimilar Cu/Al Joints
Welding copper (Cu) and aluminum (Al) is highly demanded for lightweight and cost-effective manufacturing. However, it faces significant challenges. First, substantial differences in physical properties may lead to high residual stresses and distortion. Second, brittle intermetallic compounds (IMCs) readily form at the interface, severely compromising the joint’s mechanical properties and electrical conductivity. Third, the native oxide film on Al impedes effective wetting and bonding. Therefore, effective control over the interfacial microstructure of the welded joint is essential. This review provides a critical analysis and comparison of several typical welding techniques, including laser welding (LW), friction stir welding (FSW), ultrasonic welding (UW), brazing and soldering, and welding–brazing. These analyses focus on their process characteristics, joint microstructures, and corresponding formation mechanisms. Furthermore, this review synthesizes key strategies for enhancing joint quality, including process parameter optimization, introduction of functional interlayers, and external assistance, aimed at optimizing joint microstructure and minimizing defects. Based on the analysis, this work provides comparative insights into process selection and microstructure control, and highlights future directions: advancing novel methods such as magnetic pulse welding and transient liquid phase bonding; developing intelligent real-time process control to suppress brittle IMCs and associated defects; promoting sustainable practices and establishing standardized performance evaluation; and systematically investigating long-term reliability to support the industrial application of robust Cu/Al joints.
Open AccessWelding Techniques and Microstructural Control for Dissimilar Cu/Al Joints
Welding copper (Cu) and aluminum (Al) is highly demanded for lightweight and cost-effective manufacturing. However, it faces significant challenges. First, substantial differences in physical properties may lead to high residual stresses and distortion. Second, brittle intermetallic compounds (IMCs) readily form at the interface, severely compromising the joint’s mechanical properties and electrical conductivity. Third, the native oxide film on Al impedes effective wetting and bonding. Therefore, effective control over the interfacial microstructure of the welded joint is essential. This review provides a critical analysis and comparison of several typical welding techniques, including laser welding (LW), friction stir welding (FSW), ultrasonic welding (UW), brazing and soldering, and welding–brazing. These analyses focus on their process characteristics, joint microstructures, and corresponding formation mechanisms. Furthermore, this review synthesizes key strategies for enhancing joint quality, including process parameter optimization, introduction of functional interlayers, and external assistance, aimed at optimizing joint microstructure and minimizing defects. Based on the analysis, this work provides comparative insights into process selection and microstructure control, and highlights future directions: advancing novel methods such as magnetic pulse welding and transient liquid phase bonding; developing intelligent real-time process control to suppress brittle IMCs and associated defects; promoting sustainable practices and establishing standardized performance evaluation; and systematically investigating long-term reliability to support the industrial application of robust Cu/Al joints.