Zhenyan Liang

Zhenyan Liang

*This is an algorithmically generated author record based on publicly available information.

Current Organizations / Institutes

The organizations/institutes from the scholar's latest article


Zhenyan Liang has a total of 4 co-authors. Here are the top co-authors by number of shared publications:

  • Hongbo Cheng

    Institute of Advanced Energy Materials and Chemistry, School of Chemistry and Chemical Engineering, Qilu University of Technology (Shandong Academy of Sciences), Jinan 250353, China

    2 shared publications
  • Jun Ouyang

    Department of Physics, Seton Hall University, South Orange, NJ 07079, USA

    2 shared publications
  • Shijing Chen

    Hunan Provincial Key Laboratory of Thin Film Materials and Devices, School of Materials Science and Engineering, Xiangtan University, Xiangtan 411105, China

    2 shared publications
  • Zefeng Guo

    School of Chemistry and Chemical Engineering, Qilu University of Technology (Shandong Academy of Sciences), Jinan 250353, China

    2 shared publications

Latest Publications

  • Open Access

    Large Transverse Piezoelectricity in Highly (001)-Oriented PZT Thick Films on Titanium Substrates

    by Zefeng Guo, Jun Ouyang, Shijing Chen, Zhenyan Liang, Hongbo Cheng

    Integration of lead zirconate titanate (PZT) films on metallic substrates is important for flexible piezoelectric devices, but achieving highly textured crystallinity without detrimental interfacial diffusion or oxidation remains challenging. In this work, PZT thick films (~1.3 μm) were deposited on titanium substrates using radio-frequency magnetron sputtering at 400 °C followed by rapid thermal processing at 640 °C for 2.5 min. A conductive LaNiO3 buffer layer was introduced to promote the nucleation of the perovskite phase and suppress interfacial degradation. The resulting PZT films on the LNO/Pt/Ti substrates exhibit a strong (001) preferred orientation and a dense microstructure. The films show a large remnant polarization Pr of ~61 μC cm−2 and a low coercive field Ec of ~56 kV cm−1 at 60 V, together with a dielectric constant εr of ~1350–1612 and a dielectric loss tanδ ≤ 0.06 in the frequency range of 1 kHz to 1 MHz. Patterned Pt/PZT/LNO/Pt/Ti cantilevers yield a transverse piezoelectric coefficient e31,f of ~−6.7 C/m2, significantly outperforming reported piezoelectric films deposited on Ti. These results demonstrate that controlled nucleation and rapid thermal crystallization enable highly textured PZT films on reactive metallic substrates, providing a viable route for flexible piezoelectric MEMS devices.

  • Open Access

    Large Transverse Piezoelectricity in Highly (001)-Oriented PZT Thick Films on Titanium Substrates

    by Zefeng Guo, Jun Ouyang, Shijing Chen, Zhenyan Liang, Hongbo Cheng

    Integration of lead zirconate titanate (PZT) films on metallic substrates is important for flexible piezoelectric devices, but achieving highly textured crystallinity without detrimental interfacial diffusion or oxidation remains challenging. In this work, PZT thick films (~1.3 μm) were deposited on titanium substrates using radio-frequency magnetron sputtering at 400 °C followed by rapid thermal processing at 640 °C for 2.5 min. A conductive LaNiO3 buffer layer was introduced to promote nucleation of the perovskite phase and suppress interfacial degradation. The resulting PZT films on LNO/Pt/Ti substrates exhibit a strong (001) preferred orientation and dense micro-structure. The films show a large remnant polarization Pr of ~61 μC cm-2 and a low coercive field Ec of ~56 kV cm⁻¹ at 60 V, together with dielectric constants εr of ~1350–1612 and dielectric loss tanδ ≤ 0.06 in the frequency range of 1 kHz–1 MHz. Patterned Pt/PZT/LNO/Pt/Ti cantilevers yield a transverse piezoelectric coefficient e31,f of ~ –6.7 C m-2, significantly outperforming reported piezoelectric films deposited on Ti. These results demonstrate that controlled nucleation and rapid thermal crystallization enable highly textured PZT films on reactive metallic substrates, providing a viable route for flexible piezoelectric MEMS devices.