TYTong Yao

Tong Yao

*This is an algorithmically generated author record based on publicly available information.

Current Organizations / Institutes

The organizations/institutes from the scholar's latest article


Tong Yao has a total of 6 co-authors. Here are the top co-authors by number of shared publications:

  • Baode Sun

    Shanghai Jiao Tong University

    1 shared publication
  • Haiyan Gao

    School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China

    1 shared publication
  • Jun Wang

    Shanghai Key Lab of Advanced High-temperature Materials and Precision Forming and State Key Lab of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai, China

    1 shared publication
  • Yaojun Miao

    School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China

    1 shared publication
  • Yufei Wang

    School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China

    1 shared publication
  • Zhikang Cao

    Shanghai Key Lab of Advanced High-temperature Materials and Precision Forming and State Key Lab of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China

    1 shared publication

Latest Publications

  • Open Access

    Physics-Guided Machine Learning for Performance Prediction and Multi-Objective Optimization of High-Conductivity Aluminum Conductors

    by Yaojun Miao, Zhikang Cao, Tong Yao, Yufei Wang, Haiyan Gao, Jun Wang, Baode Sun

    Producing high-conductivity aluminum conductors for power transmission involves 23 trace elements and multiple interconnected thermo-mechanical stages. The ultra-low alloying levels required to preserve high electrical conductivity create a narrow compositional window and highly imbalanced distributions, which hinder traditional data-driven learning. Here, we developed a physics-guided machine-learning framework based on 4458 valid industrial production records to predict tensile strength and electrical resistivity. In addition to raw composition and process parameters, we introduce ratio descriptors (e.g., Fe/Si and Al/Si) and propose a physics-informed metric termed the Equivalent Solute–Heat Index (ESHI) to couple key solute chemistry (Si, Fe, B) with normalized thermal-history intensity. Fe and Si primarily influence resistivity through impurity/solute scattering, while B mainly affects microstructural uniformity via grain refinement. Incorporating ESHI as an augmented signal into the best-performing XGB surrogate markedly improves generalizability, increasing the tensile strength R2 from 0.75 to ~0.92. SHAP analysis reveals that ESHI dominates the decision logic by modulating both targets with metallurgically interpretable mechanisms: solute-controlled scattering and thermal history-traced second-phase evolution that stabilizes the microstructure. NSGA-III was further employed to map the Pareto front and identify composition–process combinations that optimize the strength–conductivity trade-off, enabling improved mechanical reliability while minimizing resistive losses in practical power-transmission applications. Experimental validation on industrial wires confirms this reliability.