IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
Published by Institute of Electrical and Electronics Engineers (IEEE)
Abbrev: IEEE Trans. Compon. Packag. Manuf. Technol. Part B
ISSN 1070-9894EISSN 1558-3686
Database Coverage
- Scilit
Citation analysis
Publications published in 2023-2024 and cited in 2025.
- Total Citations
- 0
- Total Publications
- 0
- Average Citations
- 0.00
- Cited Publications
- 0
- Cited Publications %
- 0%
- Self Citations
- 0
- Self Citations %
- 0%
Metrics
- h5_index
- 0
- Monthly Citation Metric (MCM)
- 0
Citations per year
All citations in 2016-2026
Citation Distribution
All citations to publications in 2023-2024.
- Q1
- 0
- Med
- 0
- Q3
- 0
- 99%
- 0
- Max
- 0
Citation Origins
Publications published in 2023-2024 and cited in 2025.
- Citing Source Titles
- Citing Publishers