The preparation and performance of a novel room-temperature-cured heat-resistant adhesive for ceramic bonding
Authors:
- Jiangsong ZhangJZJiangsong Zhang
- Ruiying LuoRLRuiying Luo
- Min JiangMJMin Jiang
- Qiao XiangQXQiao Xiang
- Jinsong LiJLJinsong Li
- 1 March 2011
- journal article
- Published by Elsevier in Materials Science and Engineering: A
- Vol. 528 (6) , 2952-2959
Abstract
No abstract availableFunding Information
- National Natural Science Foundation of China (21071011)
- Beijing Municipal Science and Technology Program
This publication has 17 references indexed in Scilit:
- Joining SiC ceramics with silicon resin YR3184Ceramics International, 2009
- Effect of the evolution of phenol–formaldehyde resin on the high-temperature bondingInternational Journal of Adhesion and Adhesives, 2009
- Transient-liquid-phase and liquid-film-assisted joining of ceramicsJournal of the European Ceramic Society, 2006
- Joining of advanced ceramics in green stateMaterials Letters, 2002
- The rapidly quenched Ag-Cu-Ti ribbons for active joining of ceramicsMaterials Science and Engineering: A, 2001
- Joining of ceramic composites by microwave heatingMaterials Letters, 1999
- The use of transient FGM interlayers for joining advanced ceramicsComposites Part B: Engineering, 1997
- Study of critical failure parameters for an adhesive-bonded single lap joint with ceramic adherendsInternational Journal of Adhesion and Adhesives, 1995
- Diffusion bonding of MgF2 optical ceramicsMaterials Science and Engineering: A, 1991
- Joining of Ceramics and MetalsAnnual Review of Materials Science, 1988