Effect of both PCB thermal conductivity and nature of forced convection environment on component operating temperature: Experimental measurement and numerical prediction
Authors:
- P. TiilikkaPTP. Tiilikka
- C.-M. FagerCFC.-M. Fager
- J. RantalaJRJ. Rantala
- 7 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 128-139
Abstract
No abstract availableKeywords
This publication has 10 references indexed in Scilit:
- Generation and verification of boundary independent compact thermal models for active components according to the DELPHI/SEED methods2003
- Experimental characterization of board conduction sheets2002
- Development of JEDEC standard thermal measurement test boards2002
- Experimental determination of thermal conductivity of printed wiring boards2002
- Experimental determination of the effect of printed circuit card conductivity on the thermal performance of surface mount electronic packages2002
- Factors affecting the calculation of effective conductivity in printed circuit boards [thermal analysis]2002
- THERMAL STRATEGY FOR MODELING THE WIREBONDED PBGA PACKAGESJournal of Electronics Manufacturing, 1999
- THERMAL MODEL OF A COMPONENT PACKAGE FOR SYSTEM LEVEL APPLICATIONSJournal of Electronics Manufacturing, 1997
- A Comparison of Computational and Experimental Results for Flow and Heat Transfer From an Array of Heated BlocksJournal of Electronic Packaging, 1997
- New Jedec Standards for Thermal Measurements1997