Ion implantation as a pre-treatment method of AlN substrate for direct bonding with copper
Authors:
- M. BarlakM. Barlak
- W. OlesińskaWOW. Olesińska
- J. PiekoszewskiJPJ. Piekoszewski
- M. ChmielewskiMCM. Chmielewski
- J. JagielskiJJJ. Jagielski
- D. KalińskiDKD. Kaliński
- Z. WernerZWZ. Werner
- B. SartowskaBSB. Sartowska
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Oxidation behavior of AlN substrate at low temperatureJournal of Materials Science: Materials in Electronics, 2002
- Characterization of bond formation in SiC and Si3N4 implanted with Ti, Fe, and CoJournal of Materials Research, 2001
- Direct bonding of copper to aluminum nitrideMaterials Science and Engineering: A, 1996