Prediction of BGA solder joint array shape using improved Perzyna model and Anand model
- 30 September 2023
- journal article
- research article
- Published by Springer Nature in Welding in the World
- Vol. 67 (12) , 2765-2778
Abstract
No abstract availableKeywords
Funding Information
- National Natural Science Foundation of China (51965012)
- the Innovation Project of GUET Graduate Education (2023YCXS006)
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