Assessment of post-CMP cleaning mechanisms using statistically-designed experiments
Authors:
- G. ZhangGZG. Zhang
- G. BurdickGBG. Burdick
- F. DaiFDF. Dai
- T. BibbyTBT. Bibby
- S. BeaudoinSBS. Beaudoin
- 1 November 1998
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 332 (1-2) , 379-384
Abstract
No abstract availableThis publication has 9 references indexed in Scilit:
- Post cleaning of chemical mechanical polishing processApplied Surface Science, 1996
- On particle adhesion and removal mechanisms in turbulent flowsJournal of Adhesion Science and Technology, 1994
- Measurement of the adhesion and removal forces of submicrometer particles on silicon substratesJournal of Adhesion Science and Technology, 1993
- Application of Chemical Mechanical Polishing to the Fabrication of VLSI Circuit InterconnectionsJournal of the Electrochemical Society, 1991
- An Analysis of Particle Adhesion on Semiconductor SurfacesJournal of the Electrochemical Society, 1985
- Adhesion of Dust and Powder1982
- A sphere in contact with a plane wall in a slow linear shear flowChemical Engineering Science, 1968
- Mutual coagulation of colloidal dispersionsTransactions of the Faraday Society, 1966
- The lift on a small sphere in a slow shear flowJournal of Fluid Mechanics, 1965