Interfacial reaction and shear strength of ultrasonically-assisted Sn-Ag-Cu solder joint using composite flux
Authors:
- Haozhong WangHWHaozhong Wang
- Xiaowu HuXHXiaowu Hu
- Xiongxin JiangXJXiongxin Jiang
- Yulong LiYLYulong Li
- 1 February 2021
- journal article
- research article
- Published by Elsevier in Journal of Manufacturing Processes
- Vol. 62, 291-301
Abstract
No abstract availableKeywords
Funding Information
- Outstanding Young Talents Funding of Jiangxi Province (20192BCB23002, 51765040, 20192ACB21021)
- National Natural Science Foundation of China (20192BCB23002, 51765040, 20192ACB21021)
- Natural Science Foundation of Jiangxi Province (20192BCB23002, 51765040, 20192ACB21021)
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