Strengthening mechanism of SiC-particulate reinforced Sn–3.7Ag–0.9Zn lead-free solder
Authors:
- X. WangXWX. Wang
- Y.C. LiuYLY.C. Liu
- C. WeiCWC. Wei
- H.X. GaoHGH.X. Gao
- P. JiangPJP. Jiang
- L.M. YuLYL.M. Yu
- 1 July 2009
- journal article
- Published by Elsevier in Journal of Alloys and Compounds
- Vol. 480 (2) , 662-665
Abstract
No abstract availableKeywords
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