Thermal field simulation of multi package LED module

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Abstract
To date, light-emitting diode (LED) was often manufactured as multi package module instead of single package as for the luminosity demand and cost concern. Nevertheless, the uniformity of temperature gradient may generate unbalanced stress along the multi package interface, resulting in lifespan and output degradation. It is hence obligatory to predict and model the thermal transfer performance of the LED module prior to the manufacturing process as to ensure output quality and prevent catastrophic failure.

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