Retarding growth of Ni3P crystalline layer in Ni(P) substrate by reacting with Cu-bearing Sn(Cu) solders
Authors:
- S.J. WangSWS.J. Wang
- C.Y. LiuCLC.Y. Liu
- 1 November 2003
- journal article
- Published by Elsevier in Scripta Materialia
- Vol. 49 (9) , 813-818
Abstract
No abstract availableThis publication has 8 references indexed in Scilit:
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