Comparative studies on microstructures, strengths and reliabilities of two types of AlN direct bonding copper substrates
Authors:
- Xin WeiXWXin Wei
- Haixian XuHXHaixian Xu
- Jun ZhanJZJun Zhan
- Hao ZhangHZHao Zhang
- Ye CaoYCYe Cao
- Song CuiSCSong Cui
- Wenming TangWTWenming Tang
- 1 October 2018
- journal article
- research article
- Published by Elsevier in Ceramics International
- Vol. 44 (15) , 18935-18941
Abstract
No abstract availableKeywords
Funding Information
- Projects of Scientific and Technological Research (15czz02047, 1604a0902162)
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