Solder Fatigue Problems in Power Packages
Authors:
- J. BurgessJBJ. Burgess
- R. CarlsonRCR. Carlson
- H. GlascockHGH. Glascock
- C. NeugebauerCNC. Neugebauer
- H. WebsterHWH. Webster
- 1 December 1984
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 7 (4) , 405-410
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- Structured Copper: A Pliable High Conductance Material for Bonding to Silicon Power DevicesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983
- Hot Spots Caused by Voids and Cracks in the Chip Mountdown Medium in Power Semiconductor PackagingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983
- The Direct Bonding of Metals to Ceramics by the Gas‐Metal Eutectic MethodJournal of the Electrochemical Society, 1975