Dielectric thickness and ground width effect on multilayer coplanar components and circuits for ceramic multichip modules

This publication has 8 references indexed in Scilit:

• Advanced Multilayer Thick-Film System-on-Package Technology for Miniaturized and High Performance CPW Microwave Passive Components
  IEEE Transactions on Components, Packaging and Manufacturing Technology, 2011
• A compact, ultra-broadband coplanar-waveguide bandpass filter with simple open- and short-stub structures
  Microwave and Optical Technology Letters, 2010
• Multilayer thick-film photoimageable technology for 60 GHz system-in-package
  2008
• Design and performance of a 60-GHz multi-chip module receiver employing substrate integrated waveguides
  IET Microwaves, Antennas & Propagation, 2007
• Millimeter-wave substrate integrated waveguides and filters in photoimageable thick-film technology
  IEEE Transactions on Microwave Theory and Techniques, 2005
• Ultrawideband characterisation of photoimageable thick film materials for microwave and millimeter-wave design
  2005
• RFIC and MMIC Design and Technology
  2001
• Mode conversion at discontinuities in finite-width conductor-backed coplanar waveguide
  IEEE Transactions on Microwave Theory and Techniques, 1989