Wideband Vertical Transition Featuring a 3-D Chamfer-Like Design Based on Fuzz Button for Board-to-Board Interconnects

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Abstract
This letter proposes a wideband vertical transition for multilayer PCBs based on a fuzz button. The discontinuity in the vertical transition is analyzed, and an etched aperture is introduced in the ground plane beneath the connecting pad to compensate for the parasitic capacitance arising from the intentionally oversized pad. This technique extends the concept of chamfering from 2-D microstrip bends to a 3-D chamfer-like design in vertical interconnects. A three-stage transformer is further employed to enhance the impedance matching, enabling the wideband operation from DC to 35 GHz. A back-to-back measurement is conducted for verification, demonstrating a return loss below −10 dB from DC to 33.8 GHz and an insertion loss below 0.5 dB at 30 GHz. The proposed vertical transition offers a promising solution for high-density, removable interconnects in multilayer PCB applications.
Funding Information
  • Applied Basic Research Key Project of Yunnan Province (PCL2024A01)
  • Shenzhen Science and Technology Program (JCYJ20230807091814030)
  • Science and Technology Planning Project of Guangdong Province (2025A1515011109)
  • National Natural Science Foundation of China (62471211)

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