Atomistic simulation of mechanical behavior of Cu/Cu3Sn solder interface with Kirkendall void under shear and tensile deformation
- 13 March 2023
- journal article
- research article
- Published by Springer Nature in Applied Physics A
- Vol. 129 (4) , 1-10
Abstract
No abstract availableKeywords
Funding Information
- Ministry of Science and Technology, Taiwan (MOST 110-2221-E-033-029, 109-2221-992-009-MY3)
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