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Atomistic simulation of mechanical behavior of Cu/Cu3Sn solder interface with Kirkendall void under shear and tensile deformation
Publication with shared reference
10.1007/s00339-023-06558-5
Home
Publications
Atomistic simulation of mechanical behavior of Cu/Cu3Sn solder interface with Kirkendall void under shear and tensile deformation
Publication with shared reference
10.1007/s00339-023-06558-5
Publications with shared reference:
Atomistic simulation of mechanical behavior of Cu/Cu3Sn solder interface with Kirkendall void under shear and tensile deformation
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