Thermosonic flip-chip bonding using longitudinal ultrasonic vibration
Authors:
- Wenge ZhangWZWenge Zhang
- B. SchaibleBSB. Schaible
- L.J. BondLBL.J. Bond
- Teh-Hua JuTJTeh-Hua Ju
- Yung-Cheng LeeYLYung-Cheng Lee
- 1 January 1998
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
- Vol. 21 (1) , 53-58
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Optimization of copper wire bonding on Al-Cu metallizationIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1995
- Controlled Collapse Reflow Chip JoiningIBM Journal of Research and Development, 1969