Filling of mesoporous silicon with copper by electrodeposition from an aqueous solution
Authors:
- Kazuhiro FukamiKFKazuhiro Fukami
- Yuki TanakaYTYuki Tanaka
- Mohamed L. ChourouMCMohamed L. Chourou
- Tetsuo SakkaTSTetsuo Sakka
- Yukio H. OgataYOYukio H. Ogata
- 1 March 2009
- journal article
- Published by Elsevier in Electrochimica Acta
- Vol. 54 (8) , 2197-2202
Abstract
No abstract availableThis publication has 17 references indexed in Scilit:
- Filling of TiO2 Nanotubes by Self‐Doping and ElectrodepositionAdvanced Materials, 2007
- Formation of metal wire arrays via electrodeposition in pores of Si, Ge and III–V semiconductorsPhysica Status Solidi (a), 2007
- Deep Silicon Macropores Filled with Copper by ElectrodepositionJournal of the Electrochemical Society, 2007
- Electron beam lithographic techniques and electrochemical reactions for the micro- and nanostructuring of surfaces under extreme conditionsJournal of Electroceramics, 2006
- Synthesis and Electrochemical Properties of Single-Crystal V2O5 Nanorod Arrays by Template-Based ElectrodepositionThe Journal of Physical Chemistry B, 2004
- Electrodeposition of Metallic Nanowire Thin Films Using Mesoporous Silica TemplatesAdvanced Materials, 2003
- Antimony Nanowire Arrays Fabricated by Pulsed Electrodeposition in Anodic Alumina MembranesAdvanced Materials, 2002
- Damascene copper electroplating for chip interconnectionsIBM Journal of Research and Development, 1998
- Electrodeposition of metals into porous siliconThin Solid Films, 1995
- Nickel Plating on Porous SiliconJournal of the Electrochemical Society, 1985