Dangling bonds and vacancies in germanium
Open Access
- 14 January 2013
- journal article
- research article
- Published by American Physical Society (APS) in Physical Review B
- Vol. 87 (3) , 035203
Abstract
The quest for metal-oxide-semiconductor field-effect transistors (MOSFETs) with higher carrier mobility has triggered great interest in germanium-based MOSFETs. Still, the performance of germanium-based devices lags significantly behind that of their silicon counterparts, possibly due to the presence of defects such as dangling bonds (DBs) and vacancies. Using screened hybrid functional calculations we investigate the role of DBs and vacancies in germanium. We find that the DB defect in germanium has no levels in the band gap; it acts as a negatively charged acceptor with the (0/1) transition level below the valence-band maximum (VBM). This explains the absence of electron-spin-resonance observations of DBs in germanium. The vacancy in germanium has a much lower formation energy than the vacancy in silicon and is stable in a number of charge states, depending on the position of the Fermi level. We find the (0/1) and (1/2) transition levels at 0.16 and 0.38 eV above the VBM; the spacing of these levels is explained based on the strength of intraorbital repulsion. We compare these results with calculations for silicon, as well as with available experimental data.
Keywords
Funding Information
- National Science Foundation
This publication has 51 references indexed in Scilit:
- Paramagnetic Ge dangling bond type defects at (100)Si1−xGex/SiO2 interfaces (Invited Paper)Microelectronic Engineering, 2009
- Nontrigonal Ge dangling bond interface defect in condensation-grownPhysical Review B, 2009
- Germanium MOSFET Devices: Advances in Materials Understanding, Process Development, and Electrical PerformanceJournal of the Electrochemical Society, 2008
- Subnanometer-equivalent-oxide-thickness germanium p-metal-oxide-semiconductor field effect transistors fabricated using molecular-beam-deposited high-k/metal gate stackApplied Physics Letters, 2006
- Ge n-MOSFETs on lightly doped substrates with high-/spl kappa/ dielectric and TaN gateIEEE Electron Device Letters, 2006
- Interface traps and dangling-bond defects in (100)Ge∕HfO2Applied Physics Letters, 2005
- Self-Aligned n-Channel Germanium MOSFETs With a Thin Ge Oxynitride Gate Dielectric and Tungsten GateIEEE Electron Device Letters, 2004
- Germanium MOS capacitors incorporating ultrathin high-/spl kappa/ gate dielectricIEEE Electron Device Letters, 2002
- Passivation of P b0 and P b1 interface defects in thermal (100) Si/SiO2 with molecular hydrogenApplied Physics Letters, 1996
- Relationship between stress and dangling bond generation at the (111)Si/interfacePhysical Review Letters, 1993