The mechanical, thermodynamic, and electronic properties of cubic Au4Al crystal via first-principles calculations
Authors:
- Wen-Hwa ChenWCWen-Hwa Chen
- Hsien-Chie ChengHCHsien-Chie Cheng
- Ching-Feng YuCYChing-Feng Yu
- 1 December 2016
- journal article
- research article
- Published by Elsevier in Journal of Alloys and Compounds
- Vol. 689, 857-864
Abstract
No abstract availableKeywords
Funding Information
- Ministry of Science and Technology (103-2221-E-007-010, 103-2221-E-035-024-MY3)
This publication has 38 references indexed in Scilit:
- Growth behaviour of gold-aluminum intermetallic phases (IMP) in temperature aged ball bonds observed by electron backscatter diffraction2010
- Effects of particle size on the mechanical properties of particle-reinforced Sn-Ag composite solder jointScience China Technological Sciences, 2009
- Key Factors in Cu Wire Bonding Reliability: Remnant Aluminum and Cu/Al IMC Thickness2008
- Degradation and failure mechanisms in thermally exposed Au–Al ball bondsJournal of Materials Research, 2004
- The effect of Pd and Cu in the intermetallic growth of alloy Au wireJournal of Electronic Materials, 2003
- First-principles simulation: ideas, illustrations and the CASTEP codeJournal of Physics: Condensed Matter, 2002
- Generalized Gradient Approximation Made SimplePhysical Review Letters, 1996
- Effect of aging on fatigue crack growth at sn-pb/cu interfacesMetallurgical and Materials Transactions A, 1995
- Inhomogeneous Electron GasPhysical Review B, 1964
- Diffusion in evaporated films of gold-aluminiumPhilosophical Magazine, 1962