Assembly and reliability of PBGA packages on FR-4 PCBs with SnAgCu solder
Authors:
- P. ArulvananPAP. Arulvanan
- Z.W. ZhongZZZ.W. Zhong
- 1 November 2006
- journal article
- Published by Elsevier in Microelectronic Engineering
- Vol. 83 (11-12) , 2462-2468
Abstract
No abstract availableKeywords
This publication has 23 references indexed in Scilit:
- The reliability assessment of flip chip componentsMicroelectronics International, 2004
- A cohesive zone model for low cycle fatigue life prediction of solder jointsMicroelectronic Engineering, 2004
- Finite element analysis of a three‐dimensional packageSoldering & Surface Mount Technology, 2003
- Determination of Packaging Material Properties Utilizing Image Correlation TechniquesJournal of Electronic Packaging, 2002
- Finite element analysis and simulation of adhesive bonding, soldering and brazing an addendum: a bibliography (1996 2002)Modelling and Simulation in Materials Science and Engineering, 2002
- The evaluation of different base materials for high density flip chip on flex applicationsMicroelectronics International, 2001
- Reliability of FCOB with and without encapsulationSoldering & Surface Mount Technology, 2001
- Flip the ChipScience, 2000
- Assembly issues in three flip chip processesMicroelectronics International, 2000
- Assembly and reliability of flip chip on boards using ACAs or eutectic solder with underfillMicroelectronics International, 1999