Growth behavior of intermetallic compounds and early formation of cracks in Sn-3Ag-0.5Cu solder joints under extreme temperature thermal shock
Authors:
- Ruyu TianRTRuyu Tian
- Chunjin HangCHChunjin Hang
- Yanhong TianYTYanhong Tian
- Liyou ZhaoLZLiyou Zhao
Top Cited Papers
- 1 January 2018
- journal article
- research article
- Published by Elsevier in Materials Science and Engineering: A
- Vol. 709, 125-133
Abstract
No abstract availableKeywords
Funding Information
- National Natural Science Foundation of China (51522503, 51775141)
- Program for New Century Excellent Talents in University (NCET-13-0175)
- SAST (JH20140530)
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