Modeling of copper wire bonding process on high power LEDs
Authors:
- Zhaohui ChenZCZhaohui Chen
- Yong LiuYLYong Liu
- Sheng LiuSLSheng Liu
- 1 January 2011
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 51 (1) , 171-178
Abstract
No abstract availableKeywords
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