Bond-quality characterization of silicon-glass anodic bonding
Authors:
- David McIntyreDMDavid McIntyre
- 1 May 1997
- journal article
- Published by Elsevier in Sensors and Actuators A: Physical
- Vol. 60 (1-3) , 223-227
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- ISAAC:
- Selection of glass, anodic bonding conditions and material compatibility for silicon-glass capacitive sensorsSensors and Actuators A: Physical, 1995
- Fracture mechanics for thin-film adhesionIBM Journal of Research and Development, 1994
- Role of surface morphology in wafer bondingJournal of Applied Physics, 1991
- Bubble-Free Wafer Bonding of GaAs and InP on Silicon in a MicrocleanroomJapanese Journal of Applied Physics, 1989