Fatigue testing method for fine bond wires in an LQFP package
Authors:
- B. CzernyBCB. Czerny
- A. Mazloum-NejadariAMA. Mazloum-Nejadari
- G. KhatibiGKG. Khatibi
- L. WeissLWL. Weiss
- M. ZehetbauerMZM. Zehetbauer
- 1 September 2016
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 64, 270-275
Abstract
No abstract availableKeywords
Funding Information
- Austriasn Federal Ministry of Science, Research and Economy
- National Foundation for Research, Technology and Development
- Infineon AG simulation's group
This publication has 7 references indexed in Scilit:
- Interface reliability and lifetime prediction of heavy aluminum wire bondsMicroelectronics Reliability, 2016
- Role of intermetallics on the mechanical fatigue behavior of Cu–Al ball bond interfacesJournal of Alloys and Compounds, 2015
- Fatigue life evaluation of wire bonds in LED packages using numerical analysisMicroelectronics Reliability, 2014
- Experimental and analytical study of geometry effects on the fatigue life of Al bond wire interconnectsMicroelectronics Reliability, 2013
- Recrystallization, Electric Flame-Off Characteristics, and Electron Backscatter Diffraction of Copper Bonding WiresIEEE Transactions on Advanced Packaging, 2010
- Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond padsMicroelectronics Reliability, 2006
- A study of the mechanical and fatigue properties of metallic microwiresFatigue & Fracture of Engineering Materials & Structures, 2005