Effect of solder layer crack on the thermal reliability of Insulated Gate Bipolar Transistors
Authors:
- Mingxing DuMDMingxing Du
- Qiuya GuoQGQiuya Guo
- Ziwei OuyangZOZiwei Ouyang
- Kexin WeiKWKexin Wei
- William Gerard HurleyWHWilliam Gerard Hurley
Open Access
- 1 September 2019
- journal article
- research article
- Published by Elsevier in Case Studies in Thermal Engineering
- Vol. 14
Abstract
No abstract availableKeywords
Funding Information
- Natural Science Foundation of Tianjin Municipal Science and Technology Commission
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