Remarkable breakdown voltage enhancement in AlGaN channel high electron mobility transistors
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- 30 June 2008
- journal article
- conference paper
- Published by AIP Publishing in Applied Physics Letters
- Vol. 92 (26) , 263502
Abstract
The channel layer substitution of a wider bandgap AlGaN for a conventional GaN in high electron mobility transistors (HEMTs) is an effective method of enhancing the breakdown voltage. We demonstrated a remarkable breakdown voltage enhancement in these AlGaN channel HEMTs. The obtained maximum breakdown voltages were 463 and in the HEMT with the gate-drain distances of 3 and , respectively. This result is very promising for the further higher power operation of high-frequency HEMTs.
Keywords
This publication has 9 references indexed in Scilit:
- Improvement of Al-Polar AlN Layer Quality by Three-Stage Flow-Modulation Metalorganic Chemical Vapor DepositionApplied Physics Express, 2008
- First Operation of AlGaN Channel High Electron Mobility TransistorsApplied Physics Express, 2007
- C-doped semi-insulating GaN HFETs on sapphire substrates with a high breakdown voltage and low specific on-resistanceJournal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena, 2007
- Al- and N-polar AlN layers grown on c-plane sapphire substrates by modified flow-modulation MOCVDJournal of Crystal Growth, 2007
- Ion implantation doping for AlGaN/GaN HEMTsphysica status solidi (c), 2006
- Highly Reliable 250 W GaN High Electron Mobility Transistor Power AmplifierJapanese Journal of Applied Physics, 2005
- A C-Band AlGaN/GaN HEMT with Cat-CVD SiN Passivation Developed for an Over 100 W Operation2005
- Highly resistive GaN layers formed by ion implantation of Zn along the c axisJournal of Applied Physics, 2003
- Gallium nitride based high power heterojunction field effect transistors: process development and present status at UCSBIEEE Transactions on Electron Devices, 2001