Adhesive-free bonding for hetero-integration of InP based coupons micro-transfer printed on SiO2 into Complementary Metal-Oxide-Semiconductor backend for Si photonics application on 8″ wafer platform
Authors:
- K. AnandKAK. Anand
- P. SteglichPSP. Steglich
- J. KreisslJKJ. Kreissl
- C.A. ChavarinCCC.A. Chavarin
- D. SpiritoDSD. Spirito
- M. FranckMFM. Franck
- G. LecciGLG. Lecci
- I. CostinaICI. Costina
- N. HerfurthNHN. Herfurth
- J. KatzerJKJ. Katzer
- C. MaiCMC. Mai
- A. BeckerABA. Becker
Open Access
- 29 May 2024
- journal article
- research article
- Published by Elsevier in Thin Solid Films
- Vol. 799
Abstract
No abstract availableKeywords
Funding Information
- BMBF Berlin
- FMD
- Bundesministerium für Forschung, Technologie und Raumfahrt (13N14936, 16FMD03)
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