Microstructural analysis of Sn-3.0Ag-0.5Cu-TiO2 composite solder alloy after selective electrochemical etching
Open Access
- 1 January 2020
- journal article
- research article
- Published by IOP Publishing in Materials Research Express
- Vol. 7 (1) , 016583
Abstract
No abstract availableKeywords
Funding Information
- FRGS (203.PBahan.6071377 (Ref: FRGS/1/2017/TK05/USM/02/2)
- Regionalna Inicjatywa doskonałości (006/RID/2018/19)
- National Research, Development, and Innovation Office (NKFIH, FK 127970)
This publication has 26 references indexed in Scilit:
- Effect of TiO2 nanoparticles on the horizontal hardness properties of Sn-3.0Ag-0.5Cu-1.0TiO2 composite solderCeramics International, 2019
- Effects of TiO2 nanoparticles addition on physical and soldering properties of Sn–xTiO2 composite solderJournal of Materials Science: Materials in Electronics, 2019
- Influence of dual ceramic nanomaterials on the solderability and interfacial reactions between lead-free Sn-Ag-Cu and a Cu conductorJournal of Alloys and Compounds, 2018
- Synthesis and characterization of ceramic nanoparticles reinforced lead-free solderCeramics International, 2017
- Microstructure and mechanical properties of Pb-free Sn–3.0Ag–0.5Cu solder pastes added with NiO nanoparticles after reflow soldering processMaterials & Design, 2016
- Centrifuge and storage precipitation of TiO 2 nanoparticles by the sol–gel methodJournal of Alloys and Compounds, 2015
- Improving the shear strength of Sn–Ag–Cu–Ni/Cu–Zn solder joints via modifying the microstructure and phase stability of Cu–Sn intermetallic compoundsIntermetallics, 2014
- Effects of TiO2 nanoparticles addition on microstructure, microhardness and tensile properties of Sn–3.0Ag–0.5Cu–xTiO2 composite solderMaterials & Design (1980-2015), 2014
- Suppressing effect of 0.5wt.% nano-TiO2 addition into Sn–3.5Ag–0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal agingJournal of Alloys and Compounds, 2011
- Interaction behavior between the additives and Sn in Sn–3.0Ag–0.5Cu-based solder alloys and the relevant joint solderabilityJournal of Alloys and Compounds, 2008