Size and constraint effects on mechanical and fracture behavior of micro-scale Ni/Sn3.0Ag0.5Cu/Ni solder joints
Authors:
- H.B. QinHQH.B. Qin
- X.P. ZhangXZX.P. Zhang
- M.B. ZhouMZM.B. Zhou
- J.B. ZengJZJ.B. Zeng
- Y.-W. MaiYMY.-W. Mai
- 1 November 2014
- journal article
- Published by Elsevier in Materials Science and Engineering: A
- Vol. 617, 14-23
Abstract
No abstract availableKeywords
Funding Information
- Natural Science Foundation of China (51275178)
- Research Fund for Doctoral Program of Higher Education of China (20110172110003)
- Fundamental Research Fund for Central Universities (SCUT-2013ZM0026)
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