Fully automated hot embossing processes utilizing high resolution working stamps
Authors:
- T. GlinsnerTGT. Glinsner
- G. KreindlGKG. Kreindl
- E. RoyERE. Roy
- T. WieserTWT. Wieser
- C. ThannerCTC. Thanner
- D. TreiblmayrDTD. Treiblmayr
- R. MillerRMR. Miller
- P. LindnerPLP. Lindner
- 1 May 2010
- journal article
- Published by Elsevier in Microelectronic Engineering
- Vol. 87 (5-8) , 1037-1040
Abstract
No abstract availableKeywords
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- Nanoimprint lithography with a commercial 4-in. bond system for hot embossing2001