XPS analysis of the groove wearing marks on flank face of diamond tool in nanometric cutting of silicon wafer
Authors:
- W.J. ZongWZW.J. Zong
- T. SunTST. Sun
- D. LiDLD. Li
- K. ChengKCK. Cheng
- Y.C. LiangYLY.C. Liang
- 1 December 2008
- journal article
- Published by Elsevier in International Journal of Machine Tools and Manufacture
- Vol. 48 (15) , 1678-1687
Abstract
No abstract availableKeywords
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