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  3. XPS analysis of the groove wearing marks on flank face of diamond tool in nanometric cutting of silicon wafer
  4. Publication with shared reference
  5. 10.1016/j.ijmachtools.2008.06.008
  1. Home
  2. Publications
  3. XPS analysis of the groove wearing marks on flank face of diamond tool in nanometric cutting of silicon wafer
  4. Publication with shared reference
  5. 10.1016/j.ijmachtools.2008.06.008

Publications with shared reference:

XPS analysis of the groove wearing marks on flank face of diamond tool in nanometric cutting of silicon wafer

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