The Complete Packaging Reliability Studies through One Digital Image Correlation System

Authors:
Publisher website
Google Scholar
Abstract
Three-dimensional (3-D) digital image correlation (DIC) has been gradually adopted by industry these years. This method utilizes a pair of cameras to accumulate and correlate images through tracking the movement of features on the specimen surface in real time. It is capable of generating both in-plane and out-of-plane deformation during one test. To some extent, it is perfect to be utilized in the reliability analysis for electronic packages due to its high measurement accuracy and adjustable field of view. Therefore, it attracts much attention from the electronic packaging area. In this work, several reliability studies of the electronic packages with 3-D DIC system were introduced. The advantages of DIC were discussed and some features were compared to the conventional measurement methods. At the same time, the methodology, to make full use of this technique to achieve most information with DIC system, was described. With one DIC system, the 2-D strain measurement of solders, micro-bumps and the underfill can be done to learn the internal residual stress and strain distribution under loading. Meanwhile, both CTE and warpage results were generated by the 3-D DIC experiment by one measurement for assessing the reliability of the packages and validating the effectiveness of the finite element models.

This publication has 15 references indexed in Scilit: