Interfacial IMC growth of SAC305/Cu joint with a novel dual-layer of Ni(P)/Cu plating during solid-state aging
Authors:
- Yongqiang WanYWYongqiang Wan
- Xiaowu HuXHXiaowu Hu
- Tao XuTXTao Xu
- Yulong LiYLYulong Li
- Xiongxin JiangXJXiongxin Jiang
- 1 November 2018
- journal article
- research article
- Published by Elsevier in Microelectronic Engineering
- Vol. 199, 69-79
Abstract
No abstract availableKeywords
Funding Information
- Natural Science Foundation of Jiangxi Province (20171ACB21011)
- Natural Science Foundation of Jiangxi Province (20161BAB206122)
- Aeronautical Science Foundation of China (51765040, 51665038, 51465039)
This publication has 29 references indexed in Scilit:
- Reliability evaluation on a submicron Ni(P) thin film for lead-free solderingThin Solid Films, 2013
- Void formation at the interface in Sn/Cu solder jointsMicroelectronics Reliability, 2011
- Effects of bump size on deformation and fracture behavior of Sn3.0Ag0.5Cu/Cu solder joints during shear testingMaterials Science and Engineering: A, 2011
- Introduction of an Electroless-Plated Ni Diffusion Barrier in Cu/Sn/Cu Bonding Structures for 3D IntegrationJournal of the Electrochemical Society, 2011
- Electromigration of Sn–3Ag–0.5Cu and Sn–3Ag–0.5Cu–0.5Ce–0.2Zn solder joints with Au/Ni(P)/Cu and Ag/Cu padsJournal of Alloys and Compounds, 2009
- Shear strength and interfacial microstructure of Sn–Ag–xNi/Cu single shear lap solder jointsMaterials Science and Engineering: A, 2007
- Interfacial reactions on electrolytic Ni and electroless Ni(P) metallization with Sn–In–Ag–Cu solderJournal of Alloys and Compounds, 2005
- Retarding growth of Ni3P crystalline layer in Ni(P) substrate by reacting with Cu-bearing Sn(Cu) soldersScripta Materialia, 2003
- Tin–lead (SnPb) solder reaction in flip chip technologyMaterials Science and Engineering: R: Reports, 2001
- Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripeningPhysical Review B, 1996