Planar Antenna for Terahertz Application in Fan Out Wafer Level Package

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Abstract
This paper shows the terahertz planar antenna integration module structure using a fan out wafer level package (FOWLP), and the important parameters when that structure is designed. A FOWLP enabled a low-loss connection. Embedding an insulator and reflector into the mold resin improved flexibility of the module design. In this paper, the patch antenna was employed as a planar antenna in a proposed structure, and that antenna was operated at 300 GHz. For the design of this structure, two parameters were noted as the most important factors. One was the thickness of the insulator of the patch antenna. The optimal thickness of between 40 μm and 80 μm allowed the radiation efficiency to remain high. The other factor was the gaps of the vias between the ground of the microstrip line and the reflector. The gaps of a quarter-wavelength or less made the antenna characteristics excellent.