Step Coverage and Electrical Properties of (Ba, Sr)TiO3 Films Prepared by Liquid Source Chemical Vapor Deposition Using TiO(DPM)2
Authors:
- Takaaki KawaharaTKTakaaki Kawahara
- Mikio YamamukaMYMikio Yamamuka
- Tetsuro MakitaTMTetsuro Makita
- Jiro NakaJNJiro Naka
- Akimasa YuukiAYAkimasa Yuuki
- Noboru MikamiNMNoboru Mikami
- Kouichi OnoKOKouichi Ono
- 1 September 1994
- journal article
- Published by IOP Publishing in Japanese Journal of Applied Physics
- Vol. 33 (9S) , 5129-5134
Abstract
Thin films of (Ba, Sr)TiO3 (BST) with high dielectric constant were prepared on Pt/ SiO2/Si substrates of 6-inch-diameter by liquid source chemical vapor deposition using Ba(DPM)2, Sr(DPM)2 and TiO(DPM)2 (DPM=dipivaloylmethanato; C11H19O2) dissolved in tetrahydrofuran (THF). The reproducibility of ±3 % for the film composition was achieved by optimizing the deposition procedures. It was found that the coverage of 72%, obtained at the substrate temperature T s=753 K, was better than those obtained using other Ti sources such as Ti(O-i-Pr)4 (TTIP) and Ti(O-i-Pr)2(DPM)2. The electrical properties of the 480-Å-thick BST film, deposited at T s=753 K using TiO(DPM)2, were as follows: dielectric constant ε=230, equivalent SiO2 thickness t eq=7.8 Å, leakage current density J L=6.7×10-6 A/cm2 at 1.65 V and dielectric loss tan δ=0.013.Keywords
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