Characterization of packaging warpage, residual stress and their effects on the mechanical reliability of IGBT power modules
Authors:
- Wei SunWSWei Sun
- Lizhe WangLWLizhe Wang
- Nan ZhuNZNan Zhu
- Jiyuan XinJXJiyuan Xin
- Yunchao LuoYLYunchao Luo
- Xingrui JiangXJXingrui Jiang
- Guohua FanGFGuohua Fan
- Min ChenMCMin Chen
- 29 July 2023
- journal article
- research article
- Published by Elsevier in Engineering Failure Analysis
- Vol. 152
Abstract
No abstract availableKeywords
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