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Publications
Characterization of packaging warpage, residual stress and their effects on the mechanical reliability of IGBT power modules
Publication with shared reference
10.1016/j.engfailanal.2023.107517
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Publications
Characterization of packaging warpage, residual stress and their effects on the mechanical reliability of IGBT power modules
Publication with shared reference
10.1016/j.engfailanal.2023.107517
Publications with shared reference:
Characterization of packaging warpage, residual stress and their effects on the mechanical reliability of IGBT power modules
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