Eric Stern
Current Organizations / Institutes
The organizations/institutes from the scholar's latest article
Eric Stern has a total of 20 co-authors. Here are the top co-authors by number of shared publications:
- Mark A. Reed
Department of Electrical Engineering, Yale University, New Haven, CT 06511, USA
3 shared publications - Daniel Turner-Evans
Affiliation Department of Molecular, Cell and Developmental Biology, University of California Santa Cruz, Santa Cruz, California, United States of America
2 shared publications - G. Cheng
Departments of Electrical Engineering, Yale University, New Haven, USA
2 shared publications Benjamin Boese
Departments of Biomedical Engineering, Chemical Engineering, Applied Physics, Mechanical Engineering, and Electrical Engineering, Yale University, P.O. Box 208248, New Haven, Connecticut 06520, Department of Chemical Engineering, The City College of New York, 138th Street at Convent Avenue, New York, New York 10031, and Department of Biochemistry, Ohio University, 350 West State Street, Athens, Ohio 45701
1 shared publicationC. Li
University of Southern California Department of Electrical Engineering-Electrophysics Building OHE 106 Mail Code 1455, University Park, Los Angeles, California 90089
1 shared publicationC. Zhou
University of Southern California Department of Electrical Engineering-Electrophysics Building OHE 106 Mail Code 1455, University Park, Los Angeles, California 90089
1 shared publication
Latest Publications
- 9 September 2006
- Published by Springer Nature in Applied Physics A
- Vol. 85 (3) , 233-240
Indium oxide nanostructures
- 9 September 2006
- Published by Springer Nature in Applied Physics A
- Vol. 85 (3) , 233-240
Indium oxide nanostructures
- 17 August 2006
- Published by American Chemical Society (ACS) in Analytical Chemistry
- Vol. 78 (18) , 6340-6346
Electropolymerization on Microelectrodes: Functionalization Technique for Selective Protein and DNA Conjugation
A critical shortcoming of current surface functionalization schemes is their inability to selectively coat patterned substrates at micrometer and nanometer scales. This limitation prevents localized deposition of macromolecules at high densities, thereby restricting the versatility of the surface. A new approach for functionalizing lithographically patterned substrates that eliminates the need for alignment and, thus, is scalable to any dimension is reported. We show, for the first time, that electropolymerization of derivatized phenols can functionalize patterned surfaces with amine, aldehyde, and carboxylic acid groups and demonstrate that these derivatized groups can covalently bind molecular targets, including proteins and DNA. With this approach, electrically conducting and semiconducting materials in any lithographically realizable geometry can be selectively functionalized, allowing for the sequential deposition of a myriad of chemical or biochemical species of interest at high density to a surface with minimal cross-contamination.
- 17 August 2006
- Published by American Chemical Society (ACS) in Analytical Chemistry
- Vol. 78 (18) , 6340-6346
Electropolymerization on Microelectrodes: Functionalization Technique for Selective Protein and DNA Conjugation
A critical shortcoming of current surface functionalization schemes is their inability to selectively coat patterned substrates at micrometer and nanometer scales. This limitation prevents localized deposition of macromolecules at high densities, thereby restricting the versatility of the surface. A new approach for functionalizing lithographically patterned substrates that eliminates the need for alignment and, thus, is scalable to any dimension is reported. We show, for the first time, that electropolymerization of derivatized phenols can functionalize patterned surfaces with amine, aldehyde, and carboxylic acid groups and demonstrate that these derivatized groups can covalently bind molecular targets, including proteins and DNA. With this approach, electrically conducting and semiconducting materials in any lithographically realizable geometry can be selectively functionalized, allowing for the sequential deposition of a myriad of chemical or biochemical species of interest at high density to a surface with minimal cross-contamination.
- 1 January 2006
- Published by American Vacuum Society in Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena
- Vol. 24 (1) , 231-236
Methods for fabricating Ohmic contacts to nanowires and nanotubes
A comparison of methods to create Ohmic contacts to semiconductor nanowires (NWs) and carbon nanotubes (CNTs) is presented. A lift-off metallization was used to contact GaN and NWs and CNTs using electron-beam (e-beam) or optical lithography. In order to render the metal-semiconductor contacts Ohmic, e-beam-processed devices are found to require a postfabrication, high-temperature anneal, whereas the use of an oxygen plasma prior to metallization is found to be crucial for devices defined by optical lithography.- 1 January 2006
- Published by American Vacuum Society in Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena
- Vol. 24 (1) , 231-236
Methods for fabricating Ohmic contacts to nanowires and nanotubes
A comparison of methods to create Ohmic contacts to semiconductor nanowires (NWs) and carbon nanotubes (CNTs) is presented. A lift-off metallization was used to contact GaN and NWs and CNTs using electron-beam (e-beam) or optical lithography. In order to render the metal-semiconductor contacts Ohmic, e-beam-processed devices are found to require a postfabrication, high-temperature anneal, whereas the use of an oxygen plasma prior to metallization is found to be crucial for devices defined by optical lithography.