Wilfried Vandervorst

OrbiSIMS is a secondary ion mass spectrometry method with dual mass analyzers: a time-of-flight (ToF) mass spectrometer for high-speed imaging and an Orbitrap™ for high mass resolving power and mass accuracy. Originally developed for biological imaging, there is now growing interest in the application to semiconductor materials to resolve peak interferences that obfuscate analysis in traditional SIMS depth profiling experiments. We use a new method to calibrate the Orbitrap intensity scale to true counts, which allows comparison of the useful yield and duty cycle with a magnetic sector instrument and a time-of-flight instrument using an Sb implant in the silicon sample. The useful yield of the Orbitrap and magnetic sector instruments (for one detected peak) are similar. However, since the magnetic sector instrument has serial mass detection, its useful yield reduces as more peaks are analyzed. While the ToF instrument has parallel detection, it has a low duty cycle and the useful yield is two orders of magnitude lower for 1000 eV Cs+ sputtering. The depth resolution was also compared from the measurement of the downslope from depth profiles of an Sb delta multilayer. For 1000 eV Cs+ sputtering, the downslopes are 3.9, 2.3, and 2.7 nm/decade for Orbitrap, magnetic sector, and ToF instruments, respectively. Ion trajectory simulation shows that the poorer depth resolution of the OrbiSIMS is in part due to ion beam distortion at low energy.

Evaporation Dynamics of Boron Dopants in Silicon - Volume 27 Issue S1

A scheme to correct for inaccuracies in the compositional analysis of SixGe1-x by Atom Probe Tomography - Volume 27 Issue S1

Scanning Spreading Resistance Microscopy is a well-established technique for obtaining quantitative two- and three-dimensional carrier profiles in semiconductor devices with sub-nm spatial resolution. However, for sub-100 nm devices, the use of focused ion beam becomes inevitable for exposing the region of interest on a sample cross section. In this work, we investigate the impact of the focused ion beam milling on spreading resistance analysis and we show that the electrical effect of the focused ion beam extends far beyond the amorphous region and depends on the dopant concentration, ion beam energy, impact angle, and current density. For example, for dopant concentrations between 1.0 × 10²⁰ and 1.5 × 10¹⁶ cm⁻³ we observe dopant deactivation at least between 23 and 175 nm for a glancing 30 keV ion beam. Further, we show that dopant deactivation is caused by defect diffusion during milling and is not directly impacted by the presence of Gallium in the sample. Later, we also discuss potential ways to mitigate these effects.

Scanning spreading resistance microscopy (SSRM) is a powerful technique for quantitative two-and three-dimensional carrier profiling of semiconductor devices with sub-nm spatial resolution. However, considering the sub-10 nm dimensions of advanced devices and the introduction of three-dimensional architectures like fin field effect transistor (FinFET) and nanowires, the measured spreading resistance is easily impacted by parasitic series resistances present in the system. The limited amount of material, the presence of multiple interfaces, and confined current paths may increase the total resistance measured by SSRM beyond the expected spreading resistance, which can ultimately lead to an inaccurate carrier quantification. Here, we report a simulation assisted experimental study to identify the different parameters affecting the SSRM measurements in confined volumes. Experimentally, the two-dimensional current confinement is obtained by progressively thinning down uniformly doped blanket silicon on insulator wafers using scalpel SSRM. The concomitant SSRM provides detailed electrical information as a function of depth up to oxide interface. We show that the resistance is most affected by the interface traps in case of a heterogeneous sample, followed by the intrinsic resistance of the current carrying paths. Furthermore, we show that accurate carrier quantification is ensured for typical back contact distances of 1 μm if the region of interest is at least nine times larger than the probe radius.

Herein, the electrical contact formation between the electrodes of the micro four‐point technique and a semiconducting sample is described. It is shown that the contact is formed in two stages: a voltage‐induced electrical contact formation, followed by a current‐induced decrease in contact resistance. Moreover, a method is proposed allowing for precise control of the final contact resistance. Finally, it is demonstrated that the contacting process is similar on 1D fin structures, where the demonstrated control of the electrical contact is needed while measuring on nanometer‐wide fins in arrays with a pitch smaller than the electrode contact size.

Monolayer-thin WS2 with (0002) texture grows by chemical vapor deposition (CVD) from gas-phase precursors WF6 and H2S at a deposition temperature of 450 °C on 300 mm Si wafers covered with an amorphous Al2O3 starting surface. We investigate the growth and nucleation mechanism during the CVD process by analyzing the morphology of the WS2 crystals. The CVD process consists of two distinct growth regimes. During (i) the initial growth regime, a fast and self-limiting reaction of the CVD precursors with the Al2O3 starting surface forms predominantly monolayer-thin WS2 crystals and AlF3 crystals that completely cover the starting surface. During (ii) the steady-state growth regime, a much slower, anisotropic reaction on the bottom, first WS2 layer proceeds with the next WS2 layer growing preferentially in the lateral dimensions. We propose that the precursor adsorption reaction rate strongly diminishes when the precursors have no more access to the Al2O3 surface as soon as the WS2 layer completely covers the Al2O3 surface and that the WS2 crystal basal planes and AlF3 crystals have a low reactivity for WF6 adsorption at 450 °C. Nonetheless, a second layer of WS2 starts to form before the first WS2 layer completely covers the starting surface, albeit the surface coverage of the second layer is low (<20%, after 25 min of CVD reaction). During the steady-state growth regime, predominantly the WS2 crystals in the second monolayer continue to grow in lateral dimensions up to ∼40 nm. These crystals reach larger lateral dimensions compared to the crystals in the bottom, first layer due to low reactivity for WF6 adsorption on the WS2 basal plane compared to Al2O3. Presumably, they grow laterally by precursor species that adsorb on and diffuse across the WS2 surface, before being incorporated at the more reactive edges of the WS2 crystals in the second layer. Such a process proceeds slowly with only up to 40% surface coverage of the second WS2 layer after 150 min of CVD reaction. The CVD reaction is mediated by the starting surface: WF6 precursor preferentially adsorbs on Al2O3, whereas adsorption is not observed on SiO2. Nevertheless, WS2 grows on SiO2 in close proximity to Al2O3 in 90 nm pitch Al2O3/SiO2 line patterns. Hence, functionalization of the starting surface (e.g., SiO2 with Al2O3) can provide opportunities to grow monolayer-thin WS2 crystals at predetermined locations by selective, lateral growth with tunable crystal size, even at low deposition temperatures.