Jean-Claude Besse
Current Organizations / Institutes
The organizations/institutes from the scholar's latest article
Research Subjects
Research Interests
Jean-Claude Besse has a total of 91 co-authors. Here are the top co-authors by number of shared publications:
- Andreas Wallraff
Department of Physics, ETH Zürich, Zürich, Switzerland
14 shared publications Andreas Wallraff
Department of Physics, ETH Zurich, CH-8093 Zürich, Switzerland
6 shared publicationsChristopher Eichler
ETH Zurich
6 shared publications- Christopher Eichler
Department of Physics, ETH Zürich, Zürich, Switzerland
6 shared publications Michele C. Collodo
Department of Physics, ETH Zurich, Zurich, CH-8093, Switzerland
6 shared publications- Ants Remm
ETH Zurich
5 shared publications
Latest Publications
- Top Cited PapersOpen Access
- 11 February 2026
- Published by Springer Nature in EPJ Quantum Technology
- Vol. 13 (1)
Performance characterization of a multi-module quantum processor with static inter-chip couplers
Three-dimensional integration technologies such as flip-chip bonding are a key prerequisite to realize large-scale superconducting quantum processors. Modular architectures, in which circuit elements are spread over multiple chips, can further improve scalability and performance by enabling the integration of elements with different substrates or fabrication processes, by increasing the fabrication yield of completed devices, and by physically separating the qubits onto distinct modules to avoid correlated errors mediated by a common substrate. We present a design for a multi-chip module comprising one carrier chip and four qubit modules. Measuring two of the qubits, we analyze the readout performance, finding a mean three-level state-assignment error of $9 \times 10^{-3}$ in 200 ns. We calibrate single-qubit gates and measure a mean simultaneous randomized benchmarking error of $6 \times 10^{-4}$ , consistent with the coherence times of the qubits. Using a wiring-efficient static inter-module coupler featuring galvanic inter-chip transitions, we demonstrate a controlled-Z two-qubit gate in 100 ns with an error of $7 \times 10^{-3}$ extracted from interleaved randomized benchmarking. Three-dimensional integration, as presented here, will continue to contribute to improving the performance of gates and readout as well as increasing the qubit count in future superconducting quantum processors.- 11 February 2026
- Published by Springer Nature in EPJ Quantum Technology
- Vol. 13 (1)
Top Cited PapersOpen AccessPerformance characterization of a multi-module quantum processor with static inter-chip couplers
Three-dimensional integration technologies such as flip-chip bonding are a key prerequisite to realize large-scale superconducting quantum processors. Modular architectures, in which circuit elements are spread over multiple chips, can further improve scalability and performance by enabling the integration of elements with different substrates or fabrication processes, by increasing the fabrication yield of completed devices, and by physically separating the qubits onto distinct modules to avoid correlated errors mediated by a common substrate. We present a design for a multi-chip module comprising one carrier chip and four qubit modules. Measuring two of the qubits, we analyze the readout performance, finding a mean three-level state-assignment error of $9 \times 10^{-3}$ in 200 ns. We calibrate single-qubit gates and measure a mean simultaneous randomized benchmarking error of $6 \times 10^{-4}$ , consistent with the coherence times of the qubits. Using a wiring-efficient static inter-module coupler featuring galvanic inter-chip transitions, we demonstrate a controlled-Z two-qubit gate in 100 ns with an error of $7 \times 10^{-3}$ extracted from interleaved randomized benchmarking. Three-dimensional integration, as presented here, will continue to contribute to improving the performance of gates and readout as well as increasing the qubit count in future superconducting quantum processors. - Open Access
- 16 December 2025
- Published by American Physical Society (APS) in PRX Quantum
- Vol. 6 (4)
Resource-Efficient Cross-Platform Verification with Modular Superconducting Devices
Large-scale quantum computers are expected to benefit from modular architectures. Validating the capabilities of modular devices requires benchmarking strategies that assess performance within and between modules. In this work, we evaluate cross-platform verification protocols, which are critical for quantifying how accurately different modules prepare the same quantum state—a key requirement for modular scalability and system-wide consistency. We demonstrate these algorithms using a six-qubit flip-chip superconducting quantum device consisting of two 3-qubit modules on a single carrier chip, with connectivity for intra- and intermodule entanglement. We examine how the resource requirements of protocols relying solely on classical communication between modules scale exponentially with qubit number, and demonstrate that introducing an intermodule two-qubit gate enables subexponential scaling in cross-platform verification. This approach reduces the number of repetitions required by a factor of 4 for three-qubit states, with greater reductions projected for larger and higher-fidelity devices.
- 16 December 2025
- Published by American Physical Society (APS) in PRX Quantum
- Vol. 6 (4)
Open AccessResource-Efficient Cross-Platform Verification with Modular Superconducting Devices
Large-scale quantum computers are expected to benefit from modular architectures. Validating the capabilities of modular devices requires benchmarking strategies that assess performance within and between modules. In this work, we evaluate cross-platform verification protocols, which are critical for quantifying how accurately different modules prepare the same quantum state—a key requirement for modular scalability and system-wide consistency. We demonstrate these algorithms using a six-qubit flip-chip superconducting quantum device consisting of two 3-qubit modules on a single carrier chip, with connectivity for intra- and intermodule entanglement. We examine how the resource requirements of protocols relying solely on classical communication between modules scale exponentially with qubit number, and demonstrate that introducing an intermodule two-qubit gate enables subexponential scaling in cross-platform verification. This approach reduces the number of repetitions required by a factor of 4 for three-qubit states, with greater reductions projected for larger and higher-fidelity devices.
- Open Access
- 28 August 2025
- Published by American Physical Society (APS) in Physical Review Applied
- Vol. 24 (2)
Constant-depth fan-out with real-time feedforward on a superconducting quantum processor
When using unitary gate sequences, the growth in depth of many quantum circuits with output size poses significant obstacles to practical quantum computation. The quantum fan-out operation, which reduces the circuit depth of quantum algorithms such as the quantum Fourier transform and Shor’s algorithm, is an example that can be realized in constant depth independent of the output size. Here, we demonstrate a quantum fan-out gate with real-time feedforward on up to four output qubits using a superconducting quantum processor. By performing quantum state tomography on the output states, we benchmark our gate with input states spanning the entire Bloch sphere. We decompose the output-state error into a set of independently characterized error contributions. We extrapolate our constant-depth circuit to offer a scaling advantage compared to the unitary fan-out sequence beyond 25 output qubits with feedforward control, or beyond 17 output qubits if the classical feedforward latency is negligible. Our work highlights the potential of midcircuit measurements combined with real-time conditional operations to improve the efficiency of complex quantum algorithms.
- 28 August 2025
- Published by American Physical Society (APS) in Physical Review Applied
- Vol. 24 (2)
Open AccessConstant-depth fan-out with real-time feedforward on a superconducting quantum processor
When using unitary gate sequences, the growth in depth of many quantum circuits with output size poses significant obstacles to practical quantum computation. The quantum fan-out operation, which reduces the circuit depth of quantum algorithms such as the quantum Fourier transform and Shor’s algorithm, is an example that can be realized in constant depth independent of the output size. Here, we demonstrate a quantum fan-out gate with real-time feedforward on up to four output qubits using a superconducting quantum processor. By performing quantum state tomography on the output states, we benchmark our gate with input states spanning the entire Bloch sphere. We decompose the output-state error into a set of independently characterized error contributions. We extrapolate our constant-depth circuit to offer a scaling advantage compared to the unitary fan-out sequence beyond 25 output qubits with feedforward control, or beyond 17 output qubits if the classical feedforward latency is negligible. Our work highlights the potential of midcircuit measurements combined with real-time conditional operations to improve the efficiency of complex quantum algorithms.
- Open Access
Resource-Efficient Cross-Platform Verification with Modular Superconducting Devices
Large-scale quantum computers are expected to benefit from modular architectures. Validating the capabilities of modular devices requires benchmarking strategies that assess performance within and between modules. In this work, we evaluate cross-platform verification protocols, which are critical for quantifying how accurately different modules prepare the same quantum state -- a key requirement for modular scalability and system-wide consistency. We demonstrate these algorithms using a six-qubit flip-chip superconducting quantum device consisting of two three-qubit modules on a single carrier chip, with connectivity for intra- and inter-module entanglement. We examine how the resource requirements of protocols relying solely on classical communication between modules scale exponentially with qubit number, and demonstrate that introducing an inter-module two-qubit gate enables sub-exponential scaling in cross-platform verification. This approach reduces the number of repetitions required by a factor of four for three-qubit states, with greater reductions projected for larger and higher-fidelity devices.
Open AccessResource-Efficient Cross-Platform Verification with Modular Superconducting Devices
Large-scale quantum computers are expected to benefit from modular architectures. Validating the capabilities of modular devices requires benchmarking strategies that assess performance within and between modules. In this work, we evaluate cross-platform verification protocols, which are critical for quantifying how accurately different modules prepare the same quantum state -- a key requirement for modular scalability and system-wide consistency. We demonstrate these algorithms using a six-qubit flip-chip superconducting quantum device consisting of two three-qubit modules on a single carrier chip, with connectivity for intra- and inter-module entanglement. We examine how the resource requirements of protocols relying solely on classical communication between modules scale exponentially with qubit number, and demonstrate that introducing an inter-module two-qubit gate enables sub-exponential scaling in cross-platform verification. This approach reduces the number of repetitions required by a factor of four for three-qubit states, with greater reductions projected for larger and higher-fidelity devices.
- Open Access
- 1 July 2025
- Published by Springer Nature in Nature Communications
- Vol. 16 (1) , 1-7
Deterministic generation of two-dimensional multi-photon cluster states
Multidimensional cluster states are a key resource for robust quantum communication, measurement-based quantum computing and quantum metrology. Here, we present a device capable of emitting large-scale entangled microwave photonic states in a two dimensional ladder structure. The device consists of a pair of coupled superconducting transmon qubits which are each tuneably coupled to a common output waveguide. This architecture permits entanglement between each transmon and a deterministically emitted photonic qubit. By interleaving two-qubit gates with controlled photon emission, we generate 2 × n grids of time- and frequency-multiplexed cluster states of itinerant microwave photons. We generate states with fidelities above 0.50 for up to eight qubits and, in addition, observe nonzero localizable entanglement for states of up to 16 qubits. We expect the device architecture to be capable of generating a wide range of other tensor network states such as tree graph states, repeater states or the ground state of the toric code, and to be readily scalable to generate larger and higher dimensional states.
- 1 July 2025
- Published by Springer Nature in Nature Communications
- Vol. 16 (1) , 1-7
Open AccessDeterministic generation of two-dimensional multi-photon cluster states
Multidimensional cluster states are a key resource for robust quantum communication, measurement-based quantum computing and quantum metrology. Here, we present a device capable of emitting large-scale entangled microwave photonic states in a two dimensional ladder structure. The device consists of a pair of coupled superconducting transmon qubits which are each tuneably coupled to a common output waveguide. This architecture permits entanglement between each transmon and a deterministically emitted photonic qubit. By interleaving two-qubit gates with controlled photon emission, we generate 2 × n grids of time- and frequency-multiplexed cluster states of itinerant microwave photons. We generate states with fidelities above 0.50 for up to eight qubits and, in addition, observe nonzero localizable entanglement for states of up to 16 qubits. We expect the device architecture to be capable of generating a wide range of other tensor network states such as tree graph states, repeater states or the ground state of the toric code, and to be readily scalable to generate larger and higher dimensional states.
- 24 April 2025
- Published by American Physical Society (APS) in Physical Review Applied
- Vol. 23 (4)
Mitigating losses of superconducting qubits strongly coupled to defect modes
- 24 April 2025
- Published by American Physical Society (APS) in Physical Review Applied
- Vol. 23 (4)
Mitigating losses of superconducting qubits strongly coupled to defect modes
- Open Access
Performance Characterization of a Multi-Module Quantum Processor with Static Inter-Chip Couplers
Three-dimensional integration technologies such as flip-chip bonding are a key prerequisite to realize large-scale superconducting quantum processors. Modular architectures, in which circuit elements are spread over multiple chips, can further improve scalability and performance by enabling the integration of elements with different substrates or fabrication processes, by increasing the fabrication yield of completed devices, and by physically separating the qubits onto distinct modules to avoid correlated errors mediated by a common substrate. We present a design for a multi-chip module comprising one carrier chip and four qubit modules. Measuring two of the qubits, we analyze the readout performance, finding a mean three-level state-assignment error of $9 \times 10^{-3}$ in 200 ns. We calibrate single-qubit gates and measure a mean simultaneous randomized benchmarking error of $6 \times 10^{-4}$, consistent with the coherence times of the qubits. Using a wiring-efficient static inter-module coupler featuring galvanic inter-chip transitions, we demonstrate a controlled-Z two-qubit gate in 100 ns with an error of $7 \times 10^{-3}$ extracted from interleaved randomized benchmarking. Three-dimensional integration, as presented here, will continue to contribute to improving the performance of gates and readout as well as increasing the qubit count in future superconducting quantum processors.Open AccessPerformance Characterization of a Multi-Module Quantum Processor with Static Inter-Chip Couplers
Three-dimensional integration technologies such as flip-chip bonding are a key prerequisite to realize large-scale superconducting quantum processors. Modular architectures, in which circuit elements are spread over multiple chips, can further improve scalability and performance by enabling the integration of elements with different substrates or fabrication processes, by increasing the fabrication yield of completed devices, and by physically separating the qubits onto distinct modules to avoid correlated errors mediated by a common substrate. We present a design for a multi-chip module comprising one carrier chip and four qubit modules. Measuring two of the qubits, we analyze the readout performance, finding a mean three-level state-assignment error of $9 \times 10^{-3}$ in 200 ns. We calibrate single-qubit gates and measure a mean simultaneous randomized benchmarking error of $6 \times 10^{-4}$, consistent with the coherence times of the qubits. Using a wiring-efficient static inter-module coupler featuring galvanic inter-chip transitions, we demonstrate a controlled-Z two-qubit gate in 100 ns with an error of $7 \times 10^{-3}$ extracted from interleaved randomized benchmarking. Three-dimensional integration, as presented here, will continue to contribute to improving the performance of gates and readout as well as increasing the qubit count in future superconducting quantum processors. - Open Access
- 6 November 2023
- Published by Springer Nature in Nature Communications
- Vol. 14 (1) , 1-7
Realizing a deep reinforcement learning agent for real-time quantum feedback
Realizing the full potential of quantum technologies requires precise real-time control on time scales much shorter than the coherence time. Model-free reinforcement learning promises to discover efficient feedback strategies from scratch without relying on a description of the quantum system. However, developing and training a reinforcement learning agent able to operate in real-time using feedback has been an open challenge. Here, we have implemented such an agent for a single qubit as a sub-microsecond-latency neural network on a field-programmable gate array (FPGA). We demonstrate its use to efficiently initialize a superconducting qubit and train the agent based solely on measurements. Our work is a first step towards adoption of reinforcement learning for the control of quantum devices and more generally any physical device requiring low-latency feedback.
- 6 November 2023
- Published by Springer Nature in Nature Communications
- Vol. 14 (1) , 1-7
Open AccessRealizing a deep reinforcement learning agent for real-time quantum feedback
Realizing the full potential of quantum technologies requires precise real-time control on time scales much shorter than the coherence time. Model-free reinforcement learning promises to discover efficient feedback strategies from scratch without relying on a description of the quantum system. However, developing and training a reinforcement learning agent able to operate in real-time using feedback has been an open challenge. Here, we have implemented such an agent for a single qubit as a sub-microsecond-latency neural network on a field-programmable gate array (FPGA). We demonstrate its use to efficiently initialize a superconducting qubit and train the agent based solely on measurements. Our work is a first step towards adoption of reinforcement learning for the control of quantum devices and more generally any physical device requiring low-latency feedback.
- Open Access
- 12 January 2022
- Published by American Physical Society (APS) in Physical Review X
- Vol. 12 (1) , 011008
Realization of a Universal Quantum Gate Set for Itinerant Microwave Photons
Deterministic photon-photon gates enable the controlled generation of entanglement between mobile carriers of quantum information. Such gates have thus far been exclusively realized in the optical domain and by relying on postselection. Here, we present a nonpostselected, deterministic, photon-photon gate in the microwave frequency range realized using superconducting circuits. We emit photonic qubits from a source chip and route those qubits to a gate chip with which we realize a universal gate set by combining controlled absorption and reemission with single-qubit gates and qubit-photon controlled-phase gates. We measure quantum process fidelities of 75% for single- and of 57% for two-qubit gates, limited mainly by radiation loss and decoherence. This universal gate set has a wide range of potential applications in superconducting quantum networks.
- 12 January 2022
- Published by American Physical Society (APS) in Physical Review X
- Vol. 12 (1) , 011008
Open AccessRealization of a Universal Quantum Gate Set for Itinerant Microwave Photons
Deterministic photon-photon gates enable the controlled generation of entanglement between mobile carriers of quantum information. Such gates have thus far been exclusively realized in the optical domain and by relying on postselection. Here, we present a nonpostselected, deterministic, photon-photon gate in the microwave frequency range realized using superconducting circuits. We emit photonic qubits from a source chip and route those qubits to a gate chip with which we realize a universal gate set by combining controlled absorption and reemission with single-qubit gates and qubit-photon controlled-phase gates. We measure quantum process fidelities of 75% for single- and of 57% for two-qubit gates, limited mainly by radiation loss and decoherence. This universal gate set has a wide range of potential applications in superconducting quantum networks.
- Top Cited Papers
- 21 December 2020
- Published by American Physical Society (APS) in Physical Review Letters
- Vol. 125 (26) , 260502
Microwave Quantum Link between Superconducting Circuits Housed in Spatially Separated Cryogenic Systems
Superconducting circuits are a strong contender for realizing quantum computing systems and are also successfully used to study quantum optics and hybrid quantum systems. However, their cryogenic operation temperatures and the current lack of coherence-preserving microwave-to-optical conversion solutions have hindered the realization of superconducting quantum networks spanning different cryogenic systems or larger distances. Here, we report the successful operation of a cryogenic waveguide coherently linking transmon qubits located in two dilution refrigerators separated by a physical distance of five meters. We transfer qubit states and generate entanglement on demand with average transfer and target state fidelities of 85.8% and 79.5%, respectively, between the two nodes of this elementary network. Cryogenic microwave links provide an opportunity to scale up systems for quantum computing and create local area superconducting quantum communication networks over length scales of at least tens of meters.
- 21 December 2020
- Published by American Physical Society (APS) in Physical Review Letters
- Vol. 125 (26) , 260502
Top Cited PapersMicrowave Quantum Link between Superconducting Circuits Housed in Spatially Separated Cryogenic Systems
Superconducting circuits are a strong contender for realizing quantum computing systems and are also successfully used to study quantum optics and hybrid quantum systems. However, their cryogenic operation temperatures and the current lack of coherence-preserving microwave-to-optical conversion solutions have hindered the realization of superconducting quantum networks spanning different cryogenic systems or larger distances. Here, we report the successful operation of a cryogenic waveguide coherently linking transmon qubits located in two dilution refrigerators separated by a physical distance of five meters. We transfer qubit states and generate entanglement on demand with average transfer and target state fidelities of 85.8% and 79.5%, respectively, between the two nodes of this elementary network. Cryogenic microwave links provide an opportunity to scale up systems for quantum computing and create local area superconducting quantum communication networks over length scales of at least tens of meters.