Duy-Thanh Nguyen
Current Organizations / Institutes
The organizations/institutes from the scholar's latest article
Previous Organizations / Institutes
The organizations / institutes from the scholar's other articles in the past ten years
Duy-Thanh Nguyen has a total of 17 co-authors. Here are the top co-authors by number of shared publications:
- Ik-Joon Chang
Kyung Hee University
4 shared publications - Nhut-Minh Ho
School of Computing, National University of Singapore, Singapore
4 shared publications - Abhiroop Bhattacharjee
Department of Electrical Engineering, Yale University, New Haven, CT, USA
3 shared publications - Abhishek Moitra
Washington State University, Pullman, WA, USA
3 shared publications - Weng-Fai Wong
National University of Singapore, Singapore, Singapore
3 shared publications - Minh-Son Le
Department of Electronic Engineering, Kyung Hee University, Yongin-si 17104, Republic of Korea
2 shared publications
Latest Publications
- 18 September 2024
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Very Large Scale Integration (VLSI) Systems
- Vol. 32 (11) , 2023-2036
MCAIMem: A Mixed SRAM and eDRAM Cell for Area and Energy-Efficient On-Chip AI Memory
AI chips commonly employ SRAM memory as buffers for their reliability and speed, which contribute to high performance. However, SRAM is expensive and demands significant area and energy consumption. Previous studies have explored replacing SRAM with emerging technologies, such as nonvolatile memory, which offers fast read memory access and a small cell area. Despite these advantages, nonvolatile memory’s slow write memory access and high write energy consumption prevent it from surpassing SRAM performance in AI applications with extensive memory access requirements. Some research has also investigated embedded dynamic random access memory (eDRAM) as an area-efficient on-chip memory with similar access times as SRAM. Still, refresh power remains a concern, leaving the trade-off among performance, area, and power consumption unresolved. To address this issue, this article presents a novel mixed CMOS cell memory design that balances performance, area, and energy efficiency for AI memory by combining SRAM and eDRAM cells. We consider the proportion ratio of one SRAM and seven eDRAM cells in the memory to achieve area reduction using mixed CMOS cell memory. In addition, we capitalize on the characteristics of deep neural network (DNN) data representation and integrate asymmetric eDRAM cells to lower energy consumption. To validate our proposed MCAIMem solution, we conduct extensive simulations and benchmarking against traditional SRAM. Our results demonstrate that the MCAIMem significantly outperforms these alternatives in terms of area and energy efficiency. Specifically, our MCAIMem can reduce the area by 48% and energy consumption by $3.4\times $ compared with SRAM designs, without incurring any accuracy loss.
- 18 September 2024
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Very Large Scale Integration (VLSI) Systems
- Vol. 32 (11) , 2023-2036
MCAIMem: A Mixed SRAM and eDRAM Cell for Area and Energy-Efficient On-Chip AI Memory
AI chips commonly employ SRAM memory as buffers for their reliability and speed, which contribute to high performance. However, SRAM is expensive and demands significant area and energy consumption. Previous studies have explored replacing SRAM with emerging technologies, such as nonvolatile memory, which offers fast read memory access and a small cell area. Despite these advantages, nonvolatile memory’s slow write memory access and high write energy consumption prevent it from surpassing SRAM performance in AI applications with extensive memory access requirements. Some research has also investigated embedded dynamic random access memory (eDRAM) as an area-efficient on-chip memory with similar access times as SRAM. Still, refresh power remains a concern, leaving the trade-off among performance, area, and power consumption unresolved. To address this issue, this article presents a novel mixed CMOS cell memory design that balances performance, area, and energy efficiency for AI memory by combining SRAM and eDRAM cells. We consider the proportion ratio of one SRAM and seven eDRAM cells in the memory to achieve area reduction using mixed CMOS cell memory. In addition, we capitalize on the characteristics of deep neural network (DNN) data representation and integrate asymmetric eDRAM cells to lower energy consumption. To validate our proposed MCAIMem solution, we conduct extensive simulations and benchmarking against traditional SRAM. Our results demonstrate that the MCAIMem significantly outperforms these alternatives in terms of area and energy efficiency. Specifically, our MCAIMem can reduce the area by 48% and energy consumption by $3.4\times $ compared with SRAM designs, without incurring any accuracy loss.
- Open Access
MCAIMem: a Mixed SRAM and eDRAM Cell for Area and Energy-efficient on-chip AI Memory
AI chips commonly employ SRAM memory as buffers for their reliability and speed, which contribute to high performance. However, SRAM is expensive and demands significant area and energy consumption. Previous studies have explored replacing SRAM with emerging technologies like non-volatile memory, which offers fast-read memory access and a small cell area. Despite these advantages, non-volatile memory's slow write memory access and high write energy consumption prevent it from surpassing SRAM performance in AI applications with extensive memory access requirements. Some research has also investigated eDRAM as an area-efficient on-chip memory with similar access times as SRAM. Still, refresh power remains a concern, leaving the trade-off between performance, area, and power consumption unresolved. To address this issue, our paper presents a novel mixed CMOS cell memory design that balances performance, area, and energy efficiency for AI memory by combining SRAM and eDRAM cells. We consider the proportion ratio of one SRAM and seven eDRAM cells in the memory to achieve area reduction using mixed CMOS cell memory. Additionally, we capitalize on the characteristics of DNN data representation and integrate asymmetric eDRAM cells to lower energy consumption. To validate our proposed MCAIMem solution, we conduct extensive simulations and benchmarking against traditional SRAM. Our results demonstrate that MCAIMem significantly outperforms these alternatives in terms of area and energy efficiency. Specifically, our MCAIMem can reduce the area by 48\% and energy consumption by 3.4$\times$ compared to SRAM designs, without incurring any accuracy loss.
Open AccessMCAIMem: a Mixed SRAM and eDRAM Cell for Area and Energy-efficient on-chip AI Memory
AI chips commonly employ SRAM memory as buffers for their reliability and speed, which contribute to high performance. However, SRAM is expensive and demands significant area and energy consumption. Previous studies have explored replacing SRAM with emerging technologies like non-volatile memory, which offers fast-read memory access and a small cell area. Despite these advantages, non-volatile memory's slow write memory access and high write energy consumption prevent it from surpassing SRAM performance in AI applications with extensive memory access requirements. Some research has also investigated eDRAM as an area-efficient on-chip memory with similar access times as SRAM. Still, refresh power remains a concern, leaving the trade-off between performance, area, and power consumption unresolved. To address this issue, our paper presents a novel mixed CMOS cell memory design that balances performance, area, and energy efficiency for AI memory by combining SRAM and eDRAM cells. We consider the proportion ratio of one SRAM and seven eDRAM cells in the memory to achieve area reduction using mixed CMOS cell memory. Additionally, we capitalize on the characteristics of DNN data representation and integrate asymmetric eDRAM cells to lower energy consumption. To validate our proposed MCAIMem solution, we conduct extensive simulations and benchmarking against traditional SRAM. Our results demonstrate that MCAIMem significantly outperforms these alternatives in terms of area and energy efficiency. Specifically, our MCAIMem can reduce the area by 48\% and energy consumption by 3.4$\times$ compared to SRAM designs, without incurring any accuracy loss.
- 12 May 2023
- Published by Springer Nature
- p. 19-37
Bedot: Bit Efficient Dot Product for Deep Generative Models
- 12 May 2023
- Published by Springer Nature
- p. 19-37
Bedot: Bit Efficient Dot Product for Deep Generative Models
- Open Access
DeepCAM: A Fully CAM-based Inference Accelerator with Variable Hash Lengths for Energy-efficient Deep Neural Networks
With ever increasing depth and width in deep neural networks to achieve state-of-the-art performance, deep learning computation has significantly grown, and dot-products remain dominant in overall computation time. Most prior works are built on conventional dot-product where weighted input summation is used to represent the neuron operation. However, another implementation of dot-product based on the notion of angles and magnitudes in the Euclidean space has attracted limited attention. This paper proposes DeepCAM, an inference accelerator built on two critical innovations to alleviate the computation time bottleneck of convolutional neural networks. The first innovation is an approximate dot-product built on computations in the Euclidean space that can replace addition and multiplication with simple bit-wise operations. The second innovation is a dynamic size content addressable memory-based (CAM-based) accelerator to perform bit-wise operations and accelerate the CNNs with a lower computation time. Our experiments on benchmark image recognition datasets demonstrate that DeepCAM is up to 523x and 3498x faster than Eyeriss and traditional CPUs like Intel Skylake, respectively. Furthermore, the energy consumed by our DeepCAM approach is 2.16x to 109x less compared to Eyeriss.
Open AccessDeepCAM: A Fully CAM-based Inference Accelerator with Variable Hash Lengths for Energy-efficient Deep Neural Networks
With ever increasing depth and width in deep neural networks to achieve state-of-the-art performance, deep learning computation has significantly grown, and dot-products remain dominant in overall computation time. Most prior works are built on conventional dot-product where weighted input summation is used to represent the neuron operation. However, another implementation of dot-product based on the notion of angles and magnitudes in the Euclidean space has attracted limited attention. This paper proposes DeepCAM, an inference accelerator built on two critical innovations to alleviate the computation time bottleneck of convolutional neural networks. The first innovation is an approximate dot-product built on computations in the Euclidean space that can replace addition and multiplication with simple bit-wise operations. The second innovation is a dynamic size content addressable memory-based (CAM-based) accelerator to perform bit-wise operations and accelerate the CNNs with a lower computation time. Our experiments on benchmark image recognition datasets demonstrate that DeepCAM is up to 523x and 3498x faster than Eyeriss and traditional CPUs like Intel Skylake, respectively. Furthermore, the energy consumed by our DeepCAM approach is 2.16x to 109x less compared to Eyeriss.
- Open Access
OBET: On-the-Fly Byte-Level Error Tracking for Correcting and Detecting Faults in Unreliable DRAM Systems
With technology scaling, maintaining the reliability of dynamic random-access memory (DRAM) has become more challenging. Therefore, on-die error correction codes have been introduced to accommodate reliability issues in DDR5. However, the current solution still suffers from high overhead when a large DRAM capacity is used to deliver high performance. We present a DRAM chip architecture that can track faults at byte-level DRAM cell errors to address this problem. DRAM faults are classified as temporary or permanent in our proposed architecture, with no additional pins and with minor DRAM chip modifications. Hence, we achieve reliability comparable to that of other state-of-the-art solutions while incurring negligible performance and energy overhead. Furthermore, the faulty locations are efficiently exposed to the operating system (OS). Thus, we can significantly reduce the required scrubbing cycle by scrubbing only faulty DRAM pages while reducing the system failure probability up to 5000∼7000 times relative to conventional operation.
Open AccessOBET: On-the-Fly Byte-Level Error Tracking for Correcting and Detecting Faults in Unreliable DRAM Systems
With technology scaling, maintaining the reliability of dynamic random-access memory (DRAM) has become more challenging. Therefore, on-die error correction codes have been introduced to accommodate reliability issues in DDR5. However, the current solution still suffers from high overhead when a large DRAM capacity is used to deliver high performance. We present a DRAM chip architecture that can track faults at byte-level DRAM cell errors to address this problem. DRAM faults are classified as temporary or permanent in our proposed architecture, with no additional pins and with minor DRAM chip modifications. Hence, we achieve reliability comparable to that of other state-of-the-art solutions while incurring negligible performance and energy overhead. Furthermore, the faulty locations are efficiently exposed to the operating system (OS). Thus, we can significantly reduce the required scrubbing cycle by scrubbing only faulty DRAM pages while reducing the system failure probability up to 5000∼7000 times relative to conventional operation.
- Open Access
- 14 June 2021
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Access
- Vol. 9, 93723-93733
ZEM: Zero-Cycle Bit-Masking Module for Deep Learning Refresh-Less DRAM
In sub-20 nm technologies, DRAM cells suffer from poor retention time. With the technology scaling, this problem tends to be worse, significantly increasing refresh power of DRAM. This is more problematic in memory heavy applications such as deep learning systems, where a large amount of DRAM is required, DRAM refresh power contributes to a considerable portion of total system power. With the growth in deep learning workloads, this is set to get worse. In this work, we present a zero-cycle bit-masking (ZEM) scheme that exploits the asymmetry of retention failures, to eliminate DRAM refresh in the inference of convolution neural networks, natural language processing, and the image generation based on generative adversarial network. Through careful analysis, we derive a bit-error-rate (BER) threshold that does not affect the accuracy of inference. Our proposed architecture, along with the techniques involved, are applicable to all types of DRAMs. Our results on 16Gb devices show that ZEM can improve the performance by up to 17.31% while reducing the total energy consumed by DRAM by up to 43.03%, dependent on the type of DRAM.
- 14 June 2021
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Access
- Vol. 9, 93723-93733
Open AccessZEM: Zero-Cycle Bit-Masking Module for Deep Learning Refresh-Less DRAM
In sub-20 nm technologies, DRAM cells suffer from poor retention time. With the technology scaling, this problem tends to be worse, significantly increasing refresh power of DRAM. This is more problematic in memory heavy applications such as deep learning systems, where a large amount of DRAM is required, DRAM refresh power contributes to a considerable portion of total system power. With the growth in deep learning workloads, this is set to get worse. In this work, we present a zero-cycle bit-masking (ZEM) scheme that exploits the asymmetry of retention failures, to eliminate DRAM refresh in the inference of convolution neural networks, natural language processing, and the image generation based on generative adversarial network. Through careful analysis, we derive a bit-error-rate (BER) threshold that does not affect the accuracy of inference. Our proposed architecture, along with the techniques involved, are applicable to all types of DRAMs. Our results on 16Gb devices show that ZEM can improve the performance by up to 17.31% while reducing the total energy consumed by DRAM by up to 43.03%, dependent on the type of DRAM.
- Open Access
- 2 November 2020
- Published by Association for Computing Machinery (ACM)
- p. 1-8
DRAMA
As the density of DRAM becomes larger, the refresh overhead becomes more significant. This becomes more problematic in the systems that require large DRAM capacity, such as the training of deep neural networks (DNNs). To solve this problem, we present DRAMA, a novel architecture which employs the approximate characteristic of DNNs. We make that non-critical bits are not refreshed while critical bits are normally refreshed. The refresh time of the critical bits are concealed by employing per-bank refreshes, significantly improving the training system performance. Furthermore, the potential racing hazard of bank-refresh technique is simply prevented by our novel command scheduler in DRAM controllers. Our experiments on various recent DNNs show that DRAMA can improve the training system performance by 10.4% and save 23.77% DRAM energy compared to the conventional architecture.
- 2 November 2020
- Published by Association for Computing Machinery (ACM)
- p. 1-8
Open AccessDRAMA
As the density of DRAM becomes larger, the refresh overhead becomes more significant. This becomes more problematic in the systems that require large DRAM capacity, such as the training of deep neural networks (DNNs). To solve this problem, we present DRAMA, a novel architecture which employs the approximate characteristic of DNNs. We make that non-critical bits are not refreshed while critical bits are normally refreshed. The refresh time of the critical bits are concealed by employing per-bank refreshes, significantly improving the training system performance. Furthermore, the potential racing hazard of bank-refresh technique is simply prevented by our novel command scheduler in DRAM controllers. Our experiments on various recent DNNs show that DRAMA can improve the training system performance by 10.4% and save 23.77% DRAM energy compared to the conventional architecture.
- 1 March 2020
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 1199-1204
PCM: Precision-Controlled Memory System for Energy Efficient Deep Neural Network Training
- 1 March 2020
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 1199-1204
PCM: Precision-Controlled Memory System for Energy Efficient Deep Neural Network Training