Ping Guo
Current Organizations / Institutes
The organizations/institutes from the scholar's latest article
Research Subjects
Ping Guo has a total of 4 co-authors. Here are the top co-authors by number of shared publications:
- Jianye Zhao
School of Electronics, Peking Universityhttps://ror.org/02v51f717, No. 5 Yiheyuan Road, Haidian District, Beijing 100871, China
3 shared publications - Lin Dan
Department of Electronics, Peking University, Beijing 100871, China
3 shared publications - Hao Xu
Department of Electronics, Peking University, Beijing 100871, China
2 shared publications - Hongling Meng
Zhongkeqidi Optoelectronic Technology (Guangzhou) Co., Ltd., Guangzhou 510700, China
2 shared publications
Latest Publications
- Open Access
Optical Frequency Comb-Based Direct Two-Photon Cooling for Cold Atom Clock
The performance of the cold atom clock based on coherent population trapping (CPT) improved when the temperature decreased. In order to obtain a lower temperature in the cold atom clock, we proposed a cooling scheme in this paper that employs direct two-photon transition using optical frequency combs (OFCs). Two trains of time-delayed pulses from opposite directions were utilized to interact with atoms. It was found that the temperature of the cold atoms reached the minimum if the pulse area was and the time delay between the absorption pulse and the stimulated emission pulse was in the range from to . In this paper, it was confirmed that the proposed cooling process allowed for faster and more efficient momentum exchange between light and atoms, and the proposed cooling process could be applied to the atoms or molecules that could not be cooled to desired temperature through the single-photon cooling process. The 87Rb cooling, together with the CPT interrogating scheme using OFCs reduced the ratio value of linewidth/contrast, and the frequency stability of the cold atom clock hence improved by more than six times as per our calculation.Open AccessOptical Frequency Comb-Based Direct Two-Photon Cooling for Cold Atom Clock
The performance of the cold atom clock based on coherent population trapping (CPT) improved when the temperature decreased. In order to obtain a lower temperature in the cold atom clock, we proposed a cooling scheme in this paper that employs direct two-photon transition using optical frequency combs (OFCs). Two trains of time-delayed pulses from opposite directions were utilized to interact with atoms. It was found that the temperature of the cold atoms reached the minimum if the pulse area was and the time delay between the absorption pulse and the stimulated emission pulse was in the range from to . In this paper, it was confirmed that the proposed cooling process allowed for faster and more efficient momentum exchange between light and atoms, and the proposed cooling process could be applied to the atoms or molecules that could not be cooled to desired temperature through the single-photon cooling process. The 87Rb cooling, together with the CPT interrogating scheme using OFCs reduced the ratio value of linewidth/contrast, and the frequency stability of the cold atom clock hence improved by more than six times as per our calculation. - Open Access
- 29 January 2022
- Published by MDPI AG in Micromachines
- Vol. 13 (2) , 217
Wafer-Level Filling of MEMS Vapor Cells Based on Chemical Reaction and Evaporation
Micro-electro-mechanical system (MEMS) vapor cells are key components for sensors such as chip-scale atomic clocks (CSACs) and magnetometers (CSAMs). Many approaches have been proposed to fabricate MEMS vapor cells. In this article, we propose a new method to fabricate wafer-level filling of MEMS vapor cells based on chemical reaction and evaporation. The Cs metals are firstly obtained through the chemical reaction between cesium chloride and barium azide in a reservoir baseplate. Then, the Cs metals are evaporated to the preform through the microchannel plate and condensed on the inner glass surface of the preform. Lastly, the MEMS vapor cells are filled with buffer gas, sealed by anodic bonding, and mechanically diced into three dimensions: 5 mm × 5 mm × 1.2 mm, 4 mm × 4 mm × 1.2 mm, and 3 mm × 3 mm × 1.2 mm. The full width at half maximum (FWHM) linewidth of the coherent population trapping (CPT) signal of the MEMS vapor cells is found to be 4.33 kHz. The intrinsic linewidth is about 1638 Hz. Based on the CPT signal, the frequency stability is 4.41 × 10−12@1000 s. The results demonstrate that the presented method of the wafer-level filling of MEMS vapor cells fulfills the requirements of sensors such as CSACs.
- 29 January 2022
- Published by MDPI AG in Micromachines
- Vol. 13 (2) , 217
Open AccessWafer-Level Filling of MEMS Vapor Cells Based on Chemical Reaction and Evaporation
Micro-electro-mechanical system (MEMS) vapor cells are key components for sensors such as chip-scale atomic clocks (CSACs) and magnetometers (CSAMs). Many approaches have been proposed to fabricate MEMS vapor cells. In this article, we propose a new method to fabricate wafer-level filling of MEMS vapor cells based on chemical reaction and evaporation. The Cs metals are firstly obtained through the chemical reaction between cesium chloride and barium azide in a reservoir baseplate. Then, the Cs metals are evaporated to the preform through the microchannel plate and condensed on the inner glass surface of the preform. Lastly, the MEMS vapor cells are filled with buffer gas, sealed by anodic bonding, and mechanically diced into three dimensions: 5 mm × 5 mm × 1.2 mm, 4 mm × 4 mm × 1.2 mm, and 3 mm × 3 mm × 1.2 mm. The full width at half maximum (FWHM) linewidth of the coherent population trapping (CPT) signal of the MEMS vapor cells is found to be 4.33 kHz. The intrinsic linewidth is about 1638 Hz. Based on the CPT signal, the frequency stability is 4.41 × 10−12@1000 s. The results demonstrate that the presented method of the wafer-level filling of MEMS vapor cells fulfills the requirements of sensors such as CSACs.
- Open Access
- 14 September 2021
- Published by MDPI AG in Applied Sciences
- Vol. 11 (18) , 8536
High Vacuum Packaging of MEMS Devices Containing Heterogeneous Discrete Components
Vacuum packaging of Micro-electro-mechanical system (MEMS) devices is a hot topic for its advantages of improving performance and reducing power consumption. In this paper, the physics package of a chip scale atomic clock (CSAC), as a typical kind of MEMS device, is performed by vacuum packaging based on a systematic method proposed by us. The whole process, including low outgassing and thermal stable materials selection, prebaking for desorption, getter firing for absorption and solder reflow for vacuum sealing is introduced thoroughly. The thermogravimetric analysis or thermal gravimetric analysis (TGA) is used to analyze the thermal stability and desorption of materials. The leak rate of physics packages is measured to be less than 4 × 10−10 Pa·m3/s by helium leak detection. The residual gas pressure and composition in physics packages are analyzed after vacuum packaging. The results show a high vacuum ~0.1 Pa in the physics package. The frequency stability is improved from 4.68 × 10−11 to 1.07 × 10−11 @40,000 s. The presented method for high vacuum packaging is also applicable to other MEMS devices.
- 14 September 2021
- Published by MDPI AG in Applied Sciences
- Vol. 11 (18) , 8536
Open AccessHigh Vacuum Packaging of MEMS Devices Containing Heterogeneous Discrete Components
Vacuum packaging of Micro-electro-mechanical system (MEMS) devices is a hot topic for its advantages of improving performance and reducing power consumption. In this paper, the physics package of a chip scale atomic clock (CSAC), as a typical kind of MEMS device, is performed by vacuum packaging based on a systematic method proposed by us. The whole process, including low outgassing and thermal stable materials selection, prebaking for desorption, getter firing for absorption and solder reflow for vacuum sealing is introduced thoroughly. The thermogravimetric analysis or thermal gravimetric analysis (TGA) is used to analyze the thermal stability and desorption of materials. The leak rate of physics packages is measured to be less than 4 × 10−10 Pa·m3/s by helium leak detection. The residual gas pressure and composition in physics packages are analyzed after vacuum packaging. The results show a high vacuum ~0.1 Pa in the physics package. The frequency stability is improved from 4.68 × 10−11 to 1.07 × 10−11 @40,000 s. The presented method for high vacuum packaging is also applicable to other MEMS devices.